This report presents an architecture analysis of the MediaTek MT6303P envelope tracker integrated circuit (IC). Since envelope tracking strongly relies on passive components that currently cannot be integrated within the IC package, the analysis also involved the printed circuit board (PCB) on which the MT6303P was located. This PCB was part of a Huawei 5G mobile handset. To survive in the RF market, chip set leaders must evolve their envelop trackers to handle the power demands of 5G. The envelop tracker can be thought of as the weakest link in the RF architecture chain, solving envelop tracker efficiency could reduce cost in other areas of the entire mobile device.