Product Code
Release Date
Product Item Code
Device Manufacturer
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Samsung Exynos 990 Digital Functional Analysis Report
This report presents a Digital Functional Analysis of the S5E9830 die found inside the Samsung Exynos990 application processor package. The Exynos990 package was extracted from the Samsung Galaxy S20 Ultra (model SM-G988B).

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM plan-view micrographs showing the layout of the die at the levels, including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
  • Cost of die based on the process analysis

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