This report presents a Digital Floorplan Analysis of the Apple TMKF47 die found inside the Apple A13 Bionic APL1W85 application processor. The APL1W85 component was extracted from the Apple iPhone 11 smartphone (model A2111).

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process