HiSilicon Hi1152 Wi-Fi 6 SoC Basic Floorplan Analysis

Product Code
Release Date
Product Item Code
Device Manufacturer
HiSilicon Technologies Co. Ltd
Device Type
WiFi SoC
IoT Connectivity SoC
IoT Connectivity SoC - Basic Functional Analysis
Report Code
This report presents a Basic Floorplan Analysis of the HiSilicon Hi1152V100 Wi-Fi 6 SoC die found inside the HiSilicon Hi1152 component, which was extracted from the Huawei AX3 wireless router. It supports up to 3 Gbps peak throughput, at a peak frequency bandwidth of 160 MHz with two antennas and is torn down from the Huawei Wi-Fi AX3 Wi-Fi 6 router WS7100.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.