NXP Semiconductors K32W061 IoT SoC with NFC Tag Basic Floorplan Analysis

Product Code
BFR-2006-802
Release Date
09/09/2020
Availability
Published
Product Item Code
NXP-K32W061Z
Device Manufacturer
NXP Semiconductors
Device Type
RF Module
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2006-802
This report presents a Basic Floorplan Analysis of the NXP zRE231 and tNT3H12V1A dies found inside the NXP K32W061 component. The ARM Cortex-M4 MCU supports the Bluetooth LE 5.0, ZigBee 3.0, and thread. The device has an internal NFC tag and has multi-standard supported SoC for smart home applications.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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