NXP Semiconductors K32W061 IoT SoC with NFC Tag Basic Floorplan Analysis

Product Code
Release Date
Product Item Code
Device Manufacturer
NXP Semiconductors
Device Type
RF Module
IoT Connectivity SoC
IoT Connectivity SoC - Basic Functional Analysis
Report Code
This report presents a Basic Floorplan Analysis of the NXP zRE231 and tNT3H12V1A dies found inside the NXP K32W061 component. The ARM Cortex-M4 MCU supports the Bluetooth LE 5.0, ZigBee 3.0, and thread. The device has an internal NFC tag and has multi-standard supported SoC for smart home applications.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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