Maxim MAX32666 Microcontroller with Bluetooth 5 Basic Floorplan Analysis

Product Code
BFR-2006-801
Release Date
24/08/2020
Availability
Published
Product Item Code
MAX-MAX32666GWP
Device Manufacturer
Maxim
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2006-801
This report presents a Basic Floorplan Analysis of the Maxim ME14A die found inside the Maxim MAX32666 component, which is a low-power microcontroller with Bluetooth 5 for wearables. This is TechInsights’ first time observing the Maxim Integrated Bluetooth MCU. It features an ARM Cortex-M4 MCU with Bluetooth 5 BLE radio connectivity functions and mainly targets the connected home, wearable, and industrial applications.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
TechInsights Library

A unique vault of trusted, accurate data at your fingertips

Our analysis goes as deep as required to reveal the inner workings and secrets behind a broad range of products.