Product Code
BFR-2006-801
Availability
Published
Product Item Code
MAX-MAX32666GWP
Device Manufacturer
Maxim
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2006-801
This report presents a Basic Floorplan Analysis of the Maxim ME14A die found inside the Maxim MAX32666 component, which is a low-power microcontroller with Bluetooth 5 for wearables. This is TechInsights’ first time observing the Maxim Integrated Bluetooth MCU. It features an ARM Cortex-M4 MCU with Bluetooth 5 BLE radio connectivity functions and mainly targets the connected home, wearable, and industrial applications.
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
- Measurements of vertical and horizontal dimensions of major microstructural features
- Plan-view optical micrograph of the die delayered to the polysilicon layer
- Identification of major functional blocks on a polysilicon die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
- Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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