Qualcomm QCA6391 Wi-Fi 6/BT 5.1 SoC Basic Floorplan Analysis

Product Code
Release Date
Product Item Code
Device Manufacturer
Device Type
WiFi SoC
IoT Connectivity SoC
IoT Connectivity SoC - Basic Functional Analysis
Report Code
This report presents a Basic Floorplan Analysis of the Qualcomm HG11-YG502-200 die found inside the Qualcomm QCA6391 component. The QCA6391 package was extracted from the Xiaomi Mi 10 Pro smartphone. This is a wireless combo integrated circuit (IC) that supports the full suite of Wi-Fi 6 and Bluetooth 5.1 features for mobile and computing.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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