Silicon Labs EFR32BG22C224 Bluetooth 5.2 SoC Basic Floorplan Analysis

Product Code
BFR-2003-803
Release Date
16/04/2020
Availability
Published
Product Item Code
SII-EFR32BG22C224F512IM32-C
Device Manufacturer
Silicon Laboratories
Device Type
SoC (System-on-Chip)
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Functional Analysis
Report Code
BFR-2003-803
This report presents a Basic Floorplan Analysis of the Silicon Labs EFR52010A2 die found inside the Silicon Labs EFR32BG22C224F512IM32-C component. This is one of the few early Bluetooth SoCs that support the newly released Bluetooth 5.2 standard. A new floorplan design was found in the EFR32BG22 SoC, and it is targeting the high-volume, battery-powered IoT applications.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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