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This is an Advanced Packaging Quick Look (APQ) for the A14 APL1W01 processor package. The APL1W01 is a package-on-package (PoP) assembly using TSMC’s integrated fan out (InFO) technology. The top package contains four DRAM dies configured in two stacks of two dies. The memory is wire bonded to a printed wiring board (PWB) ball grid array (BGA). The BGA is connected to the bottom of the package by through molding vias (TMVs). The bottom package consists ofthe flip-chip processor mounted to a core-less fan out structure. The analysis was performed on the complete PoP assembly, with limited focus on the SDRAM packages.