Intel 10 nm (2nd Gen) Ice Lake Overhead SoC Design Analysis

Product Code

SDA-2001-803

Release Date

10/09/2020

Availability

Published

Product Item Code

HPC-15-dy1973cl

Device Manufacturer

Hewlett-Packard

Device Type

Laptop Computer

Subscription

Logic

Channel

Logic - SoC Design Analysis (IP)

Logic - SoC Design Analysis

Intel 10 nm (2nd Gen) Ice Lake Overhead SoC Design Analysis

This report presents an SoC Design Analysis of the Intel i7-1065G7 (Ice Lake) SRG0N Thunderbolt 3 I/O logic region, built in Intel’s 10 nm 2nd Generation high-k metal gate (HKMG) FinFET CMOS process. It is a collection of SEM montage images showing the transition between an I/O IP block and a digital logic block, showcasing the relationship to system-on-chip (SoC) design rules used on the Intel i7-1065G7 (Ice Lake) SRG0N.

The report includes

Downstream product features and SoC-level areas of analysis
Technology node contact and back-end-of-line (BEOL) process architecture assessment with stack up dimensions
Features and dummy structures of the system-on-chip (SoC) design overhead associated with the transition between design IP blocks
Scanning electron microscope (SEM) montage of a planar sample area delivered in CircuitVision
Target areas are typically transitions between different types of IP blocks, such as analog I/O to digital, or to memory, and typically contain many dummy features
Standard cell architecture by extraction and placement of multiple standard cells in the TB3 I/O logic layout
Routing density of the TB3 I/O logic digital logic library

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