This report presents a Digital Functional Analysis of the HiSilicon HI3680 V200 die found inside the HiSilicon Kirin 980 Hi3680 component. The Hi3680 component was extracted from an Huawei Mate 20 Pro smartphone with the model number LYA-AL10.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
• Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
• Plan-view optical micrograph of the die delayered to the metal gate level
• Identification of major functional blocks on a gate level die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and gate level die photographs delivered in CircuitVision Software