Product Code
FAR-1809-802
Release Date
Availability
Published
Product Item Code
APP-TMJA46
Device Manufacturer
Apple
Subscription
Logic
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Apple A12 Bionic TSMC N7 Digital Floorplan Analysis
This report presents a Digital Floorplan Analysis of the TMJA46 die found inside the Apple A12 Bionic APL1W81 applications processor. The A12 Bionic APL1W81 processor was extracted from the Apple iPhone XS Max (model A1921).

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels, including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in Circuitvision software
 

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