Product Code
DFR-2003-802
Availability
Published
Product Item Code
QUA-SDX55M
Device Manufacturer
Qualcomm
Device Type
RF Module
Subscription
Logic
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Qualcomm Snapdragon X55 5G (SDX55M) Modem-RF System TSMC N7 FinFET Process Digital Floorplan Analysis
This report presents a Digital Functional Analysis of the HG11-PG591-2 die, found inside the Qualcomm 5G SDX55M Modem-RF system package. The SDX55M RF module was extracted from a Xiaomi Mi10 5G smartphone (model M2001 J2C).
This report contains the following detailed information:
This report contains the following detailed information:
- Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
- SEM plan-view micrographs showing the layout of the die at the levels, including fin/shallow trench isolation (STI), gate, contacts, and minimum pitch metals
- Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
- Plan-view optical micrograph of the die delayered to the metal gate level
- Identification of major functional blocks on a gate level die photograph
- Table of functional block sizes and percentage die utilization
- High-resolution top metal and gate level die photographs delivered in the CircuitVision Software
- Cost of die based on the process analysis
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