A Trip Down TSMC Memory Lane – Part 3

At the end of Part 2 of the blog we had reached 2009 and the 40-nm generation; which put TSMC out of sync with other companies, who were marketing their 45-nm product. That discrepancy continued with the usual 70% shrink to the next node, 28-nm for TSMC and 32-nm for IDMs such as Intel and IBM.
07Feb

AMD’s MI300 Targets HPC and AI

AMD’s MI300 accelerator will compete with Nvidia's Grace Hopper in the HPC and AI markets. It uses AMD's third-generation CDNA3 architecture and features x86, GPU, and memory die in a single package for improved performance.
06Feb

TechInsights Critical Sub-systems Graphics file on Platform

TechInsights Critical Sub-systems Graphics file on Platform Updated CSUBS Graphics file is now available: Driving Forces Misc. Reports CSUBS Graphics 230203 CSUBS, Equipment, Macroeconomic quarterly CSUBS, Equipment sales forecast annual Supply Chain revenues and diffusion rates TechInsight’s spot
03Feb

Mobile RF – 2022 Webinar Recap

TechInsights hosted 3 webinars focused on Mobile RF technology and trends to watch for in 2022. With commentary, insights, and predictions from some of the top minds in the Mobile RF landscape, the TechInsights’ subject matter experts discussed who will be the dominant RF players, the different approaches taken to address the increased complexity brought by new standards, and the new antenna modules used by Apple in the iPhone 12 and 13.
02Feb

Hybrid Bonding Technology - 2023 and beyond

Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
01Feb