This document summarizes quarterly update (Q4/23) from companies like DC AI Chips, Nvidia, Intel and AMD, and key yearly updates (2023) for the data center AI chip market.

Unlock the future of imaging technology with TechInsights' groundbreaking discovery: Samsung's inaugural imager boasting innovative hybrid bond technology.

China is the world's largest smartphone market. It delivers high volume and revenue to device makers, component suppliers and operators. Our extensive report shows the top-100 best-selling smartphone models in China in the fourth quarter of 2023. Besides popular Apple, Honor, Oppo, Vivo, and Xiaomi models, which brands and models have made their way into the bestsellers and what is the secret behind their success?

We estimate 6.2 million handsets were shipped in Germany in Q4 2023, declining by -2% YoY during the quarter. Apple captured the leading positions across all major carriers in Germany ahead of Samsung. Xiaomi maintained its standing while Oppo lost the ground due to patent issues. vivo and Realme as well as Oppo shipped no new smartphones during the quarter.

Global smartphone shipments grew by 7% annually YoY in Q4 2023. The sixty countries tracked in this report accounted for 91% of these global shipments. Apple was the largest vendor and was followed by Samsung on consolidated shipments to these markets.

AI-capable notebook PCs - defined as a notebook PC that ships with a dedicated chipset built specifically to accelerate AI computing on device (i.e. an NPU) – will represent 95% of the total notebook PC market, or 230.5 million units, shipped in 2029.

This report presents an advanced floorplan analysis of the image signal processor (ISP) die from the Prophesee GenX320ES, 1/5″ format, 320 ×320 pixels resolution, 6.3 μm pixel pitch, stacked back-illuminated event-based Metavision® CMOS image sensor for embedded vision and power-sensitive applications.

This report provides an analysis of the structure and materials used in the manufacture of Beken BK3296 22nm Bluetooth Audio SoC manufactured in UMC's 22nm ULP process. The report includes a summary of key findings, and a detailed look at the FEOL, MOL and BEOL structures and materials used. Extensive SEM, TEM and materials analysis provide a complete look at how this device was manufactured.

Gain exclusive access to TechInsights' comprehensive 3D NAND Technology Roadmap, guiding you through the ever-evolving landscape of innovation.

Stay ahead in the dynamic world of semiconductor technology with insights into the race for maximum NAND capacity per wafer in 3D NAND production. Discover how advancements are driving innovation, pushing boundaries, and shaping the future of storage.