Mobile Radio Frequency Subscription

Analysis to enable strategic investment decisions and enhance technology development for companies in the mobile radio frequency space

Reliable, accurate, up-to-date competitive intelligence helps you plan before your next investment into transceivers and envelope power tracker devices. TechInsights’ Mobile RF subscription gives you detailed coverage and analysis of major events across a variety of manufacturers.

 

 

Get to market quicker with TechInsights Mobile Radio Frequency Subscriptions. Our data helps you plot the right development course and produce best in class products. The knowledge you need to grow your market share and revenue.

 

Download the Mobile RF Subscription Brief

 

Mobile RF Subscription

Available Mobile RF Subscriptions

Transceiver Floorplan
 

Transceiver Floorplan

Focused on leading-edge 4G and 5G transceivers, including mmWave

Includes:

  • ~8 new devices analyzed per year
  • Full access to our back catalog of 10 floorplan reports from 2019 and earlier

 

Transceiver Architecture
 

Transceiver Architecture

Includes:

  • Architecture subscription includes Floorplan content
  • A top-level block (architecture) diagram of the transceiver created from the SEM image mosaics of the upper metal layers of the metal interconnect and the polysilicon and diffusion layers
  • ~8 new devices analyzed per year - Floorplan
  • ~8 new devices analyzed per year - Architecture
  • Full access to our back catalog of 10 floorplan and 10 architecture reports from 2019 and earlier

 

Envelope Power Tracker Floorplan
 

Envelope Power Tracker Floorplan

Focused on leading-edge envelope power trackers from recent 4G and 5G smartphone platforms

Includes:

  • ~5 new devices analyzed per year
  • Full access to our back catalog of 7 floorplan reports from 2019 and earlier

 

Envelope Power Tracker Architecture
 

Envelope Power Tracker Architecture

Includes:

  • Architecture subscription includes Floorplan content
  • A top-level block (architecture) diagram of the transceiver created from the SEM image mosaics of the upper metal layers of the metal interconnect and the polysilicon and diffusion layers
  • ~5 new devices analyzed per year - Floorplan
  • ~5 new devices analyzed per year - Architecture
  • Full access to our back catalog of 7 floorplan and 7 architecture reports from 2019 and earlier

 

Front End Module Architecture
 

Front End Module Architecture

Includes:

  • CircuitVisionTM of die imaging, image folders, PDF
  • PDF contents:
    • Device Identification
      • Product
      • Module (Xray, jet etched package)
      • Dies within module (summary and die photos)
    • Module Architecture
      • Block diagram of the module showing the interconnection of the individual die within the module
  • 8 reports/year

 

 

 

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TechInsights Platform - Mobile RF Subscription
 

 

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