This report presents a Memory Functional Analysis of the Everspin EMD3D256M die found inside the Everspin EMD3D256M08G1-150CBS1 device.

This report contains the following detailed information:

• Package photographs, package X-rays, die markings, and die photographs and die photo delayered to poly-Si
• SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view SEM micrograph of memory array delayered to diffusion, polysilicon, and metal 1 layers
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the CircuitVision software
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process