Product Code
MFR-1808-804
Release Date
Availability
Published
Product Item Code
ADN-RM3313-XSNI-B
Device Manufacturer
Adesto Technologies
Device Type
ReRAM
Subscription
Memory - Embedded & Emerging
Memory - NAND & DRAM
Channel
Memory - Embedded & Emerging Floorplan Analysis
Memory - NAND Floorplan Analysis
Adesto RM3313-XSNI-B CBRAM Memory Functional Analysis
This report presents a Memory Functional Analysis of the Adesto 201052 die found inside the Adesto RM3313-XSNI-B device.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs across the memory array showing the general structure of the flash cell array, die dielectric materials, metal interconnects, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and diffusion level die photographs delivered in the CircuitVision software
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
 

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