TechInsights Logic Subscription
Reliable, accurate, up-to-date competitive intelligence helps you plan before your next investment.
TechInsights’ Logic subscription gives you detailed coverage and analysis of major events across a variety of manufacturers. Our data helps you plot the right development course and produce best-in-class products.
The knowledge you need to grow your market share and revenue
Learn what is available in a Logic subscription
Disruptive
Technology
SMIC 7nm tech found in MinerVa Bitcoin Miner
Development highlights China’s growing local options in response to international sanctions
Process & Advanced Packaging
Understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.
Process Flows
(Requires a subscription to Process & Advanced Packaging)
Enhance your Advanced Process & Packaging subscription with Process Flow Analysis (PFA), Process Flow Full Emulation (PFF), and more.
Transistor Characterization
See the complete picture of process technology and DC performance. Understand the process, see the performance, spot the trends.
SoC Design Analysis
Focused on high volume first-to-market SoCs on leading fabless / foundry combinations, this subscription provides standard cell analysis and layout analysis on multiple areas of leading-edge SoCs.
Digital Floorplan Analysis
A high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.
Transistor Architecture Comparison
10 reports, ~5 reports refreshed annually, studying the last 3 technology generations by company and across companies: TSMC, Samsung, Intel.
Analytics
(Requires a subscription to Digital Floorplan Analysis or Process Flow Analysis)
Provides tools with which to query TechInsights data, conduct independent analysis, perform comparisons, and create visualizations using data from multiple channels within the Logic vertical. Data is aggregated from reports within the Digital Floorplan or Process Flow Analysis channel to enable customers to create their own analysis and curation.
Standard Cell GDS Library Analysis
GDS layout extraction of key standard cells used in multiple areas of the leading-edge SoCs , focused on high volume first-to-market SoCs on leading fabless/foundry combinations. 16-20 standard cells extracted, schematics and GDS layout showing local routing . Image sets delivered as pdf report and GDSII files for each cell.
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Latest Posts From Our Blogs
Hybrid Bonding Technology - 2023 and beyond
Recently, TechInsights hosted a webinar where several experts from our Logic, Image Sensor, Memory, and Engineering teams reviewed applications of hybrid bonding technology and discussed what’s to come in 2023 and beyond.
Join TechInsights’ Leading Market Analysts at the 2023 Mobile World Congress
Leading market and technology analysts from TechInsights will be attending the Mobile World Congress (MWC) in Barcelona, Spain Feb. 27 – Mar. 2, 2023. During the event, our analysts will conduct business meetings, moderate conference sessions, attend briefings and provide media interviews.
Power of the Chip Series
This short-form video series will cover topical events and include insightful commentary from our TechInsight’s experts (and surprise guests) on how powerful this tiny object is.
Lithography: Now and Then
Advanced lithography techniques, which are required to print ultrafine features on to chips, are primary enablers of modern technology advancement. There are many different lithographic techniques, with EUV considered the modern-day frontrunner leading the way to the world’s most advanced chips.
Throwback to 2021 CIS Technology Trends
CMOS image sensors (CIS) have continued to evolve in response to performance requirements of current applications of Smartphone Imaging, Security Surveillance, Biometrics, Automotive and Depth Sensing and Ranging.