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Process & Advanced Packaging
Understand all aspects of advanced logic technologies, gain visibility into the competition’s historical – and anticipated – approach, and make better next-node technology choices.
- Dimensional and Materials Analysis
- 7-8 logic reports/year
- 4-5 advanced packaging reports/year
- Trend Analysis – 3 briefings / year on technical trends by technology element
- Annual seminar
Process Flows
Requires a subscription to Process & Advanced Packaging
Enhance your Advanced Process & Packaging subscription with Process Flow Analysis (PFA), Process Flow Full Emulation (PFF), and more.
- Process Flow Analysis (PFA) – Process Steps, Tool Type, Material – 7 Logic reports / year
- Process Flow Full Emulation (PFF) – 3D Emulation, Layout GDS – 4 Logic reports /year
Transistor Characterization
See the complete picture of process technology and DC performance. Understand the process, see the performance, spot the trends.
- Universal curves for IOFF vs. ION and IOFF vs. ID, LIN; Transfer and output characteristics for each universal curve data point
- Annual seminar
- Comparative analysis briefing
SoC Design Analysis
Focused on high volume first-to-market SoCs on leading fabless / foundry combinations, this subscription provides standard cell analysis and layout analysis on multiple areas of leading-edge SoCs.
- Standard cells extracted, routing efficiency assessed, accurate gate density metrics calculated
- Large area layout image sets delivered in CircuitVision, upper level metal usage surveyed
- Trend Analysis – 3 briefings / year on leading-edge SoC segments
- Annual seminar
Digital Floorplan Analysis
A high-level view of SoC design quality, focusing on leading-edge APU, CPU, GPU, AI accelerator, FPGA, baseband / connectivity, VPU, advanced MCU components, plus emerging applications such as AR and vision processing SoCs.
- Digital Functional Analysis Report (DFAR) – executive summaries supported by image sets – 18 to 20 / year
Analytics - Digital Floorplan (DFR)
Requires a subscription to Digital Floorplan Analysis
Provides tools with which to query TechInsights’ data, conduct independent analysis, perform comparisons, and create visualizations of Digital Floorplan (DFR) and other data within the Logic Vertical. DFR data is aggregated from reports within the channel to enable customers to create their own analysis and curation.
Standard Cell GDS Library Analysis
GDS layout extraction of key standard cells used in multiple areas of the leading-edge SoCs , focused on high volume first-to-market SoCs on leading fabless/foundry combinations . 16-20 standard cells extracted, schematics and GDS layout showing local routing . Image sets delivered as pdf report and GDSII files for each cell.
- Standard Cell GDS Library reports - 8 reports / year
- Design technology interaction, layout
- Trade-offs between area and routing compromises
- Get rear-view knowledge on design library compromises to help support future design library choices
- Trend Analysis – 3 briefings / year on leading-edge SoC segments
Transistor Architecture Comparison
10 reports, ~5 reports refreshed annually, studying the last 3 technology generations by company and across companies: TSMC, Samsung, Intel.
- Channel Architecture
- Gate Architecture
- Source/Drain Engineering
Interconnect and Patterning Comparison
10 reports, ~5 reports refreshed annually, studying the last 3 technology generations by company and across companies: TSMC, Samsung, Intel.
- Contacts/Vias - MOL
- Patterning - MOL & BEOL
- Dielectrics & Metallization - BEOL
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| Related Analysis | Manufacturer | Analysis Type | Subscription Channel |
|---|---|---|---|
| Analyst Briefing: Logic - SoC Design - 2020 12 | Circuit | Logic - SoC Design Analysis | |
| Analyst Briefing: Logic - Transistor Characterization 2020 12 | System | Logic - Transistor Characterization | |
| Qualcomm Snapdragon 865 GPU SoC Design Analysis | Qualcomm | Process | Logic - SoC Design Analysis |
| Qualcomm Snapdragon 865 CPU 7.5 Track SoC Design Analysis | Qualcomm | Circuit | Logic - SoC Design Analysis |
| Intel SRH4U Base die 22FFL Process aCMOS Essentials | Intel | Process | Logic - Process |
| TSMC Gate Architecture Evolution | Process | Logic - Transistor Architecture Comparison | |
| TSMC S/D Architecture Evolution | Process | Logic - Transistor Architecture Comparison | |
| HiSilicon Kirin 990 5G CPU SoC Design Analysis | HiSilicon Technologies Co. Ltd | Circuit | Logic - SoC Design Analysis |
| HiSilicon Kirin 990 5G GPU SoC Design Analysis | HiSilicon Technologies Co. Ltd | Circuit | Logic - SoC Design Analysis |
| HiSilicon Kirin 990 5G CPU SoC Design Standard Cell GDS Library Analysis | HiSilicon Technologies Co. Ltd | Circuit | Logic - Standard Cell GDS Analysis |
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Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
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TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
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SK hynix 96L 3D PUC NAND Analysis
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Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
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TechInsights Analyses iPhone 11 Cameras
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Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
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Apple iPhone 11 Pro Max Teardown
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Patent licensing: The patent battleplan
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Peloton IPO Preview: All Hype, No Muscle
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Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
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A high-end mobile phone sells almost three times what it costs to manufacture it
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Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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GaN, SiC, and Si technologies in AC Adapters
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Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
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Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
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Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
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Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
Part 2: Pixel Scaling and Scaling Enablers
4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop16Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Part 1: Chip-stacking and chip-to-chip interconnect
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Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world09Apr
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support09Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell20Feb
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP, Financial Controller
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate11Sep
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We are currently seeking a Full Stack Software Developer to join one of our Colorado TechInsights Platform development teams. Do you have a passion for solving complex and interesting problems? Do you strive to learn something new every day? Do you11Sep
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The Inside Sales Representative is a key member of the go-to-market sales team. Working in close cooperation with the outside sales and Marketing teams, you will be responsible for following up on leads while identifying new business or sales10Sep
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Thanks to our growth, we are now recruiting an individual to lead our Sales Operations functions and further evolve the business via the support of our corporate goals and objectives, including, but not limited to: reporting, analysis, business09Sep