NAND フラッシュメモリーは現在 2 番目に大きい IC 製品カテゴリーで、2018 年の収益は 2017 年から 18% 増加して 600 億ドルを超えています。この成長を後押ししたのは、高い平均販売価格、データセンターサーバーストレージでのソリッドステートドライブの使用増加、スマートフォンのメモリー容量の拡大です。
NAND 市場は現在、Samsung、東芝メモリ、Western Digital、Micron、SK hynix、Intel によって占められていますが、YMTC などの中国ベンダーからの大規模な投資も確認されています。
この分野で当社が確認した技術革新には、過去 5 年間だけで、最小加工寸法 14 nm でのダブルパターニングからクアドルプルパターニングへの移行、エアギャップの広い普及、14/15 平面部品のフル生産、3D/V-NAND 製品の発売などがあります。
将来的には、ニッチなアプリケーション以外では平面構造は姿を消していくでしょう。3D 92L/96L はすでに製品化されており、128L/144L/192L も今年か来年には市場に出るとみられます。「4D NAND」とは SK hynix バージョンの CuA (CMOS under Array) とみられ、Xtacking とはアレイ上に CMOS を積層して面積を縮小する YMTC のプロセスです。
テックインサイツが提供する価値
NAND 技術の進歩に合わせて、NAND 関連 の知財戦略も発展させる必要があります。NAND の技術革新は、業界の主要プレーヤーや特許保有企業だけでなく製造手法やメモリー密度、ビット単価まで、事実上 NAND エコシステムのあらゆる側面に影響を及ぼします。さらに、急速に進歩するこの分野で該当する侵害証拠を発見するには、リバースエンジニアリング技術を継続的に発展させていく必要があります。
テックインサイツの解析
テックインサイツは、ティアダウン/コスト計算、フロアプラン/ノード、設計要素、回路、プロセス/パッケージング、プロセスフロー解析を含む幅広い解析手法を使用して、NAND 製品に認められた技術革新を観察、調査してレポートを作成します。

テックインサイツのメモリーサブスクリプションに含まれる NAND 解析では、以下の解析を提供しています。
解析の範囲
- 最先端の平面型 NAND と 3D NAND に着目
- パッケージ画像、X 線画像
- CircuitVision (回路解析) による最上層部メタルの光学顕微鏡画像と複数のダイ画像
- CircuitVision (回路解析) による最上層部メタルの光学顕微鏡画像と複数のダイ画像
- プロセス、設計、比較、解析チームによる概要レポート
- MFR レポート: 年間 13~15 本

この分野の知財戦略を効果的に策定するには、NAND フラッシュにおける画期的な出来事を常に認識し、市場の主要プレーヤーや新規参入企業に対する知識を得て、リバースエンジニアリング技術を正しく応用して、最新の NAND 技術について世代交代で生じた変化を把握する必要があります。
テックインサイツの解析とウェブサイトを検索
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2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image
Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the
Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive
Part 2: Pixel Scaling and Scaling Enablers
4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.
Part 1: Chip-stacking and chip-to-chip interconnect
4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 2019
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software
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