Analysis to enable strategic investment decisions and enhance technology development for companies in the mobile radio frequency space
Reliable, accurate, up-to-date competitive intelligence helps you plan before your next investment into transceivers and envelope power tracker devices. TechInsights’ Mobile RF subscription gives you detailed coverage and analysis of major events across a variety of manufacturers.
Get to market quicker with TechInsights Mobile Radio Frequency Subscriptions. Our data helps you plot the right development course and produce best in class products. The knowledge you need to grow your market share and revenue.
Available Mobile RF Subscriptions
Transceiver Floorplan
Focused on leading-edge 4G and 5G transceivers, including mmWave
Includes:
- ~8 new devices analyzed per year
- Full access to our back catalog of 10 floorplan reports from 2019 and earlier
Transceiver Architecture
Includes:
- Architecture subscription includes Floorplan content
- A top-level block (architecture) diagram of the transceiver created from the SEM image mosaics of the upper metal layers of the metal interconnect and the polysilicon and diffusion layers
- ~8 new devices analyzed per year - Floorplan
- ~8 new devices analyzed per year - Architecture
- Full access to our back catalog of 10 floorplan and 10 architecture reports from 2019 and earlier
Envelope Power Tracker Floorplan
Focused on leading-edge envelope power trackers from recent 4G and 5G smartphone platforms
Includes:
- ~5 new devices analyzed per year
- Full access to our back catalog of 7 floorplan reports from 2019 and earlier
Envelope Power Tracker Architecture
Includes:
- Architecture subscription includes Floorplan content
- A top-level block (architecture) diagram of the transceiver created from the SEM image mosaics of the upper metal layers of the metal interconnect and the polysilicon and diffusion layers
- ~5 new devices analyzed per year - Floorplan
- ~5 new devices analyzed per year - Architecture
- Full access to our back catalog of 7 floorplan and 7 architecture reports from 2019 and earlier
Front End Module Architecture
Includes:
- CircuitVisionTM of die imaging, image folders, PDF
- PDF contents:
- Device Identification
- Product
- Module (Xray, jet etched package)
- Dies within module (summary and die photos)
- Module Architecture
- Block diagram of the module showing the interconnection of the individual die within the module
- Device Identification
- 8 reports/year
Front End Die Circuit
Includes:
- CircuitVisionTM of die imaging, image folders, PDF
- PDF contents:
- Device Summary (package and die)
- Architectural Overview (package, physical die, and functional die)
- Transmit Path and Feedback Path
- Receive Path and PLL
- Auxiliary Circuitry
- Major Findings
- Standard Cells
- 10-12 reports/year
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