Product Code
ACE-1708-801
Availability
Published
Product Item Code
SAM-KUS020203M-B000
Device Manufacturer
Samsung
Device Type
Multi Chip Package
Subscription
Packaging
Channel
Advanced Packaging - Process
Samsung KUS020203M-B000 PM971 NVMe SSD PoP BGA Package ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for NAND flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
- Downstream product teardown
- Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
- SEM bevel through the logic region and NAND flash
- SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
- One (or two) TEM cross sections, orthogonal to the word and/or bit lines, showing the NAND flash array cells, lower metals and dielectrics, transistor gates, isolation, and other FEOL features
- TEM bevel through the NAND flash
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