Product Code
Release Date
Product Item Code
Device Manufacturer
Device Type
Logic - Process (IP)
Logic - Process
AMD Ryzen 7 2700X (9500A Die) GLOBALFOUNDRIES 12LP Process ACMOS Essentials
The Advanced CMOS Essentials (ACE) deliverable for logic microprocessor chips with FinFETs comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • Transmission (TEM) and (SEM) bevel through the logic region and SRAM
  • TEM and SEM cross section of the general device structure, back end of line (BEOL) (metals, dielectrics) and front end of line (FEOL) structures
The results of TEM-EDS and EELS analyses are included in the ACE summary document. The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
  • Two TEM cross sections, orthogonal to the transistor gate fingers and fins showing the lower metals and dielectrics, transistor gates (NMOS and PMOS), fins, isolation, and other FEOL features.

Make informed business decisions faster and with greater confidence

Start My Free Trial

Sign up for latest analysis, news and insights from TechInsights!

Stay informed about TechInsights’ products, services, and events. Email collection adheres to TechInsights’ Privacy Policy.

Revealing the innovations others cannot inside advanced technology products

General Inquiries


1891 Robertson Rd #500, Nepean, ON K2H 5B7