EM Microelectronic EM9304 Basic Functional Analysis

Product Code
FAR-1803-806
Release Date
20/04/2018
Availability
Published
Product Item Code
EM1-EM9304
Device Manufacturer
EM Microelectronic
Device Type
Bluetooth
Subscription
IoT Connectivity SoC
Channel
IoT Connectivity SoC - Basic Floorplan Analysis
Report Code
FAR-1803-806
This report presents a basic Functional Analysis of the EM Microelectronic 9304_001 die found inside EM Microelectronic EM9304 Bluetooth module. This report presents a basic Functional Analysis of the EM Microelectronic 9304_001 die found inside EM Microelectronic EM9304 Bluetooth module. The EM9304 is a tiny, low-power, integrated circuit (IC) optimized for Bluetooth® 5.0 low energy enabled products.

This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
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