This report presents a Basic Functional Analysis of the Freescale N58R die found inside the Freescale PS32R274KAMMM molded-array ball grid array (BGA) package.This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs

SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors

Measurements of vertical and horizontal dimensions of major microstructural features

Plan-view optical micrograph of the die delayered to polysilicon

Identification of major functional blocks on a polysilicon die photograph

Table of functional block sizes and percentage die utilization

High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser

Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process