AAC Technologies 00ALP3 MEMS Microphone Analog Circuit Analysis Report

Product Code
Release Date
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Device Manufacturer
AAC Technologies
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This report presents an Analog Circuit Analysis of the EF01 ASIC die found on the AAC Technologies 00ALP3 MEMS microphone. The 00ALP3 MEMS microphone consists of a MEMS microphone and an application-specific integrated circuit (ASIC) die mounted in the same surface mount metal package. The ASIC die of the 00ALP3 MEMS microphone is manufactured in a five metal, single polysilicon 90 nm CMOS process. This chip, with a die size of 1.14 mm x 0.82 mm (die edge seal), carries the die markings EF01. This report contains the following information:
  • • a partial set of schematics with device size measurements, organized in a hierarchical manner
  • • package, X-rays, die markings, and die photographs
  • • device summary
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