This report presents an Analog Circuit Analysis of the EF01 ASIC die found on the AAC Technologies 00ALP3 MEMS microphone. The 00ALP3 MEMS microphone consists of a MEMS microphone and an application-specific integrated circuit (ASIC) die mounted in the same surface mount metal package. The ASIC die of the 00ALP3 MEMS microphone is manufactured in a five metal, single polysilicon 90 nm CMOS process. This chip, with a die size of 1.14 mm x 0.82 mm (die edge seal), carries the die markings EF01. This report contains the following information:

• a partial set of schematics with device size measurements, organized in a hierarchical manner

• package, X-rays, die markings, and die photographs

• device summary