Goodix GF5118M Fingerprint Sensor Package Analysis Report

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Release Date
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Device Type
Finger Print Sensor
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This report presents a Package Analysis of the Goodix GF5118M capacitive fingerprint sensor package extracted from the Letv X500 smartphone. The land grid array (LGA) package comprises four dies, the BD10239A, FG11, and COLORADO1M attached to the two-layer printed wiring board (PWB), and the GF818 fingerprint sensor die mounted above the other three dies, with a protection glass attached to the package top.
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