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信頼性の高い、正確かつ最新の、競合に関する情報を投資前の計画にぜひお役立てください。テックインサイツのロジック サブスクリプション サービスは、幅広い企業の画期的な技術に関する詳細な解説と解析をご提供します。
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テックインサイツのロジック サブスクリプション サービスにより、製品の速やかな市場投入が実現します。適切な開発方針とクラス最高の製品の生産の計画に役立つデータ、市場シェアと収益の拡大につながる知識が得られます。
プロセス/先進的なパッケージング
先進的なロジック技術のあらゆる側面を理解し、競合への従来と将来のアプローチに対する見識を得たうえで、次のテクノロジーノードにおいて優れた選択が行えるようになります。
内容:
- ディメンション/材料解析
- 年間約 7～8 件のロジックレポート
- 年間約 4～5 件の先進的なパッケージングレポート
- トレンド解析 – 技術分野別に傾向をまとめた概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
プロセスフロー
プロセス/先進的なパッケージング サブスクリプションのご契約が必要になります。
プロセス/先進的なパッケージング サブスクリプションを、プロセスフロー解析 (PFA)、プロセスフロー フル エミュレーション (PFF) などと組み合わせると、さらに詳細な情報が得られます。
内容:
- プロセスフロー解析 (PFA) – プロセスの手順、装置の種類、材料 – ロジックレポート: 年間 7 本
- プロセスフロー フル エミュレーション (PFF) – 3D エミュレーション、レイアウトの GDS – ロジックレポート: 年間 4 本
- 解析チームによるオンサイト訪問、プロセスフローのトレンド解析が充実
トランジスタ特性
プロセス技術と性能の全体像を見ることができ、プロセスの理解、性能の調査、傾向の把握を深められます。
内容:
- IOFF vs. ION、 IOFF vs. ID/LIN の普遍曲線、および各普遍曲線のデータポイントの伝達特性/出力特性
- 解析チームによるオンサイト訪問: 年間 1 回
- 比較解析の概要レポート
デジタル機能の解析
SoC の設計品質の概要 (最先端の APU、CPU、GPU、AI アクセラレータ、 FPGA、ベースバンド/接続機器、VPU、先進的な MCU コンポーネント、その他 AR/ビジョンプロセスなどの新しいアプリケーションにもフォーカス)
内容:
- デジタル機能解析レポート (DFAR) – 画像セットを備えた重要点の概要: 年間 18～20 本
スタンダードセル/レイアウト解析
主要なファブレス/ファウンドリの組み合わせによる市場初の量産 SoC にフォーカスし、最先端の SoC の複数の領域におけるスタンダードセル解析とレイアウト解析をご提供します。
内容:
- スタンダードセルの抽出、ルーティング効率の評価、正確なゲート密度測定
- CircuitVision (回路) 解析による広域レイアウト画像、上層メタルの使用法の調査
- トレンド解析 – 最先端の SoC の各セグメントの概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
優れたコンテンツを引き続き新しいアプリケーションで
テックインサイツの IC サブスクリプションをご契約いただきますと、必要な情報をすぐに入手できます。
新しいアプリケーションプラットフォームで実現すること:
- 全てのデータベースに高速検索エンジンでアクセス
- 特定の画像/レポートを選択して表示、ダウンロード
- データベースに追加された最新情報の簡単な判別
- 必要に応じてデータにアクセス (セルフサービス)
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最新ニュースおよびブログ
Memory Process Webinar: 3D NAND Word Line Pad (WLP)
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Intel’s 10nm Node: Past, Present, and Future – Part 2
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Apple Computers: Transitioning to ARM Chips is Coming Soon
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Revisiting the Seminal APA Optics GaN HEMT Patent
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Panasonic’s expertise in patent monetisation has never been more important
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On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
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The guide to effective NAND patent investigation
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Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
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SiC Power Transistor Process Flow Analysis: The Rohm SCT3022ALGC11 Process Flow
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Patent Portfolio Management: Effective Strategies and Best Practices in 2020
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Choosing the right patent software for better results
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Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
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Looking at the Apple A12Z Bionic System on Chip
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TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
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YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
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Samsung Galaxy S20 Ultra 5G Camera Teardown
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Samsung Galaxy S20 Ultra 5G Teardown Analysis
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Recent Analysis of Samsung’s Mobile RF Components
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Xiaomi Mi 10 Teardown Analysis
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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Recent MediaTek Mobile RF Components and Analysis
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In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
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Securing Smart Connected Homes with OTP NVM
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PC technology trends 2020-DRAM and Flash
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Apple Is About to Add a Third OLED Supplier
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Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan
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Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
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Imaging + Sensing End-of-Year Highlights
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Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
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Power Integrations Scores OEM Design Win with their PowiGaN Technology
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Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
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DRAM Scaling Challenges Grow
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Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
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The Apple U1 - Delayering the Chip and Its Possibilities
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Huawei Mate 30 Pro 5G Teardown
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
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Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
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The Evolution of SiC MOSFET Technology: A Retrospective
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The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
TechInsights has now officially released a die shot of the new Apple A13 , and we can confirm a few assumptions on our side.27Oct
Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
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TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
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How e-mobility is changing the Automotive
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E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
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SK hynix 96L 3D PUC NAND Analysis
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Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
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TechInsights Analyses iPhone 11 Cameras
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Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
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Apple iPhone 11 Pro Max Teardown
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Patent licensing: The patent battleplan
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Webinar: Preparing to License: Using tools to Scale Your Licensing Program
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Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
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How Graphical Solutions Improve 3D NAND Effective Device Density
Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.16Sep
Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
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Lithium, the white gold of technology
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Mobile manufacturing: How much do companies earn with the high end?
High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.08Sep
Peloton IPO Preview: All Hype, No Muscle
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Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
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A high-end mobile phone sells almost three times what it costs to manufacture it
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Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
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Why I keep writing ’bout holes in the sensor
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Deca Technologies Fan-In WLP in Qualcomm PM8150
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GaN, SiC, and Si technologies in AC Adapters
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Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
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Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
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Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
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Velodyne LiDAR Puck Teardown
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Part 2: Pixel Scaling and Scaling Enablers
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AC Adapters: GaN, SiC or Si?
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Part 1: Chip-stacking and chip-to-chip interconnect
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Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
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1y DDR4 DRAM from Samsung, SK hynix and Micron
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How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
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NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Samsung Galaxy S10 5G Teardown
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Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support09Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell20Feb
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ET Hosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP Finance
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate16Jul
Job Vacancy: Semiconductor Analyst
The Semiconductor Analyst will participate in major campaigns and projects initiated client-facing team, and related to analysis of devices manufactured with advanced semiconductor process technology.03May
Job Vacancy: Sales Executive - EMEA
As a Sales Executive, your mission will be to establish and develop accounts within Europe and be accountable for driving the sales process from initial engagement to close.23Apr
Job Vacancy: Senior Technology Analyst - Logic Processors
In this role, you will drive the technical analysis product roadmap for TechInsights, based on a deep understanding of customer interests and industry direction.17Apr