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信頼性の高い、正確かつ最新の、競合に関する情報を投資前の計画にぜひお役立てください。テックインサイツのロジック サブスクリプション サービスは、幅広い企業の画期的な技術に関する詳細な解説と解析をご提供します。
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テックインサイツのロジック サブスクリプション サービスにより、製品の速やかな市場投入が実現します。適切な開発方針とクラス最高の製品の生産の計画に役立つデータ、市場シェアと収益の拡大につながる知識が得られます。
プロセス/先進的なパッケージング
先進的なロジック技術のあらゆる側面を理解し、競合への従来と将来のアプローチに対する見識を得たうえで、次のテクノロジーノードにおいて優れた選択が行えるようになります。
内容:
- ディメンション/材料解析
- 年間約 7～8 件のロジックレポート
- 年間約 4～5 件の先進的なパッケージングレポート
- トレンド解析 – 技術分野別に傾向をまとめた概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
プロセスフロー
プロセス/先進的なパッケージング サブスクリプションのご契約が必要になります。
プロセス/先進的なパッケージング サブスクリプションを、プロセスフロー解析 (PFA)、プロセスフロー フル エミュレーション (PFF) などと組み合わせると、さらに詳細な情報が得られます。
内容:
- プロセスフロー解析 (PFA) – プロセスの手順、装置の種類、材料 – ロジックレポート: 年間 7 本
- プロセスフロー フル エミュレーション (PFF) – 3D エミュレーション、レイアウトの GDS – ロジックレポート: 年間 4 本
- 解析チームによるオンサイト訪問、プロセスフローのトレンド解析が充実
トランジスタ特性
プロセス技術と性能の全体像を見ることができ、プロセスの理解、性能の調査、傾向の把握を深められます。
内容:
- IOFF vs. ION、 IOFF vs. ID/LIN の普遍曲線、および各普遍曲線のデータポイントの伝達特性/出力特性
- 解析チームによるオンサイト訪問: 年間 1 回
- 比較解析の概要レポート
デジタル機能の解析
SoC の設計品質の概要 (最先端の APU、CPU、GPU、AI アクセラレータ、 FPGA、ベースバンド/接続機器、VPU、先進的な MCU コンポーネント、その他 AR/ビジョンプロセスなどの新しいアプリケーションにもフォーカス)
内容:
- デジタル機能解析レポート (DFAR) – 画像セットを備えた重要点の概要: 年間 18～20 本
スタンダードセル/レイアウト解析
主要なファブレス/ファウンドリの組み合わせによる市場初の量産 SoC にフォーカスし、最先端の SoC の複数の領域におけるスタンダードセル解析とレイアウト解析をご提供します。
内容:
- スタンダードセルの抽出、ルーティング効率の評価、正確なゲート密度測定
- CircuitVision (回路) 解析による広域レイアウト画像、上層メタルの使用法の調査
- トレンド解析 – 最先端の SoC の各セグメントの概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
優れたコンテンツを引き続き新しいアプリケーションで
テックインサイツの IC サブスクリプションをご契約いただきますと、必要な情報をすぐに入手できます。
新しいアプリケーションプラットフォームで実現すること:
- 全てのデータベースに高速検索エンジンでアクセス
- 特定の画像/レポートを選択して表示、ダウンロード
- データベースに追加された最新情報の簡単な判別
- 必要に応じてデータにアクセス (セルフサービス)
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最新ニュースおよびブログ
TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
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YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
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Samsung Galaxy S20 Ultra 5G Camera Teardown
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Samsung Galaxy S20 Ultra 5G Teardown Analysis
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan
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Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
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Power Integrations Scores OEM Design Win with their PowiGaN Technology
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Huawei Mate 30 Pro 5G Teardown
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
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The Evolution of SiC MOSFET Technology: A Retrospective
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Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
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Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
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Apple iPhone 11 Pro Max Teardown
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Peloton IPO Preview: All Hype, No Muscle
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GaN, SiC, and Si technologies in AC Adapters
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Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
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Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
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Velodyne LiDAR Puck Teardown
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Part 2: Pixel Scaling and Scaling Enablers
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AC Adapters: GaN, SiC or Si?
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Part 1: Chip-stacking and chip-to-chip interconnect
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Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
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1y DDR4 DRAM from Samsung, SK hynix and Micron
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How long can Sony keep the top spot in the image sensor market?
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Qualcomm QTM052 mmWave Antenna Module
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NAND technology: Open the gates
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Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
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Electric Cars Gain Traction, But Challenges Remain
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TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
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Samsung Galaxy S10 5G Teardown
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Analyzing innovations in mobile radio frequency front-end integration
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Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
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3D NAND Metrology Challenges Growing
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Autonomous Vehicles are Driving Innovation
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Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
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Lenovo Brings the New Snapdragon to Market
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Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
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Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
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Webinar: Using Technical Evidence to Strengthen Patents
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Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
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Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
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Automotive Patents: Owners, Technologies, and Investigating for EOU
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Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
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