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テックインサイツのロジック サブスクリプション サービスにより、製品の速やかな市場投入が実現します。適切な開発方針とクラス最高の製品の生産の計画に役立つデータ、市場シェアと収益の拡大につながる知識が得られます。
プロセス/先進的なパッケージング
先進的なロジック技術のあらゆる側面を理解し、競合への従来と将来のアプローチに対する見識を得たうえで、次のテクノロジーノードにおいて優れた選択が行えるようになります。
内容:
- ディメンション/材料解析
- 年間約 7～8 件のロジックレポート
- 年間約 4～5 件の先進的なパッケージングレポート
- トレンド解析 – 技術分野別に傾向をまとめた概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
プロセスフロー
プロセス/先進的なパッケージング サブスクリプションのご契約が必要になります。
プロセス/先進的なパッケージング サブスクリプションを、プロセスフロー解析 (PFA)、プロセスフロー フル エミュレーション (PFF) などと組み合わせると、さらに詳細な情報が得られます。
内容:
- プロセスフロー解析 (PFA) – プロセスの手順、装置の種類、材料 – ロジックレポート: 年間 7 本
- プロセスフロー フル エミュレーション (PFF) – 3D エミュレーション、レイアウトの GDS – ロジックレポート: 年間 4 本
- 解析チームによるオンサイト訪問、プロセスフローのトレンド解析が充実
トランジスタ特性
プロセス技術と性能の全体像を見ることができ、プロセスの理解、性能の調査、傾向の把握を深められます。
内容:
- IOFF vs. ION、 IOFF vs. ID/LIN の普遍曲線、および各普遍曲線のデータポイントの伝達特性/出力特性
- 解析チームによるオンサイト訪問: 年間 1 回
- 比較解析の概要レポート
デジタル機能の解析
SoC の設計品質の概要 (最先端の APU、CPU、GPU、AI アクセラレータ、 FPGA、ベースバンド/接続機器、VPU、先進的な MCU コンポーネント、その他 AR/ビジョンプロセスなどの新しいアプリケーションにもフォーカス)
内容:
- デジタル機能解析レポート (DFAR) – 画像セットを備えた重要点の概要: 年間 18～20 本
スタンダードセル/レイアウト解析
主要なファブレス/ファウンドリの組み合わせによる市場初の量産 SoC にフォーカスし、最先端の SoC の複数の領域におけるスタンダードセル解析とレイアウト解析をご提供します。
内容:
- スタンダードセルの抽出、ルーティング効率の評価、正確なゲート密度測定
- CircuitVision (回路) 解析による広域レイアウト画像、上層メタルの使用法の調査
- トレンド解析 – 最先端の SoC の各セグメントの概要レポート: 年間 3 本
- 解析チームによるオンサイト訪問: 年間 1 回
優れたコンテンツを引き続き新しいアプリケーションで
テックインサイツの IC サブスクリプションをご契約いただきますと、必要な情報をすぐに入手できます。
新しいアプリケーションプラットフォームで実現すること:
- 全てのデータベースに高速検索エンジンでアクセス
- 特定の画像/レポートを選択して表示、ダウンロード
- データベースに追加された最新情報の簡単な判別
- 必要に応じてデータにアクセス (セルフサービス)
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最新ニュースおよびブログ
Webinar: An Examination of the Technical and Financial Implications of the Apple iPhone 12
An Examination of the Technical and Financial Implications of the Apple iPhone 12 November 10, 2020 This webinar is presented by TechInsights Join TechInsights and Bloomberg Intelligence Analysts as they share their technical and financial insights10Nov
Inside the STMicroelectronics MasterGaN1 Integrated GAN High Voltage Half-Bridge -TechStream Power Semiconductor Blog
Sinjin Dixon-Warren, Senior Process Analyst Sinjin Dixon-Warren is a Senior Process Analyst at TechInsights with over 20 years of experience with semiconductor analysis and is a Subject Matter Expert (SME) for Power Electronics Analysis. He holds a03Nov
Micro Loading And Its Impact On Device Performance
How SEMulator3D can be used to study micro loading and manufacturing variability in an advanced DRAM process that exhibits a wiggling AA profile.02Nov
Webinar: ALD/ALE Process in Commercially Available Memory Devices
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October Apples: Apple iPhone 12 Pro Teardown - Teardown TechStream Blog
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iPhone Camera History: iPhone 12's Alternative and Normal
The evolutionary history of the iPhone camera can also be seen as the history of the development of the phone CIS, even if the iPhone does not fully follow the CIS technology trends to advance. Just take this opportunity, but also through the last21Oct
New GDDR6X from Micron - Memory TechStream Blog
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STMicroelectronics Displaces Sony ToF in Galaxy Note Series - Image Sensor TechStream Blog
Ray Fontaine, Product Manager – Image Sensor Ray is one of the preeminent image sensor technology experts in the world, and he regularly publishes Image Sensor analysis content and commentary for TechInsights subscribers. October 11, 2020 Samsung11Oct
A New Player Emerges in the GaN Charger Market – Innoscience INN650D02 Found Inside the Rock RH-PD65W USB-C Charger
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Quick View on Samsung 128L (136T) 3D V-NAND - Memory TechStream Blog
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UnitedSiC Takes the Road Less Travelled with their SiC JFET Technology - Power Semiconductor TechStream Blog
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Avalanche 40 nm pMTJ STT-MRAM - Memory TechStream Blog
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Hybrid Bonding Expands from Image Sensors to Logic, Memory - Image Sensor, Logic & Memory TechStream Blog
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Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing
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DRAM, 3D NAND Face New Challenges
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SK hynix 128L 3D PUC NAND (4D NAND)
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Inside the Intel RealSense L515 LiDAR Camera
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Webinar: ALD/ALE Process in Commercially Available Logic Devices
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Samsung S5K33D i-ToF with 7 µm Pixel Global Shutter - Image Sensor TechStream Blog
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60 years of the Semiconductor industry and its changing patent strategy
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A Review of the Chevy Bolt Powertrain
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Memory Process Webinar: 3D NAND Word Line Pad (WLP)
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Intel’s 10nm Node: Past, Present, and Future – Part 2
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Apple Computers: Transitioning to ARM Chips is Coming Soon
Quand on dit ce mois-ci, c’est à l’occasion de la Conférence des développeurs qui se tiendra dans la semaine du 22 juin, un événement très important appelé WWDC ou Worldwide Developers Conference qui se tient en Californie, à San José ou à San11Jun
Revisiting the Seminal APA Optics GaN HEMT Patent
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Panasonic’s expertise in patent monetisation has never been more important
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On Demand Webinar: A Review of the Power Device Ecosystem & IP Landscape for GaN
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The guide to effective NAND patent investigation
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Unlocking the Secrets of the YMTC 64-Layer 3D Xtacking® NAND Flash
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SiC Power Transistor Process Flow Analysis: The Rohm SCT3022ALGC11 Process Flow
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Patent Portfolio Management: Effective Strategies and Best Practices in 2020
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Analysis of Qualcomm's Snapdragon SDR865 Transceiver; supporting 5G sub-6 Ghz and LTE services
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Looking at the Apple A12Z Bionic System on Chip
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TechInsights Confirms Samsung’s true 7LPP process in the Samsung Exynos 990
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YMTC is China's First Mass Producer of 3D NAND Flash Memory Chips
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Samsung Galaxy S20 Ultra 5G Camera Teardown
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Samsung Galaxy S20 Ultra 5G Teardown Analysis
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Recent Analysis of Samsung’s Mobile RF Components
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Xiaomi Mi 10 Teardown Analysis
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If Apple is hurting due to the coronavirus, its suppliers and rivals likely are too
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Recent MediaTek Mobile RF Components and Analysis
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In 2020, 3D flash memory will be fully upgraded to 100 multi-layer stacks
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Securing Smart Connected Homes with OTP NVM
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新年の幕開けに、パーソナルコンピュータのハードウェア技術の動向を占う「PCテクノロジートレンド」をお届けする。04Jan
Apple Is About to Add a Third OLED Supplier
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Huawei Mate 30 Pro 5G dismantling: sell 6399 yuan complete machine, BOM cost is only 2799 yuan
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Deep dismantling of Huawei Mate30 Pro 5G: more than 2,000 components from Japan
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Imaging + Sensing End-of-Year Highlights
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What’s Next For High Bandwidth Memory
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Seoul Semiconductor patent auction analysis reveals a mixed bag of assets
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Power Integrations Scores OEM Design Win with their PowiGaN Technology
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Toshiba-WD Alliance 3D NAND mass production will use Samsung TCAT process
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Developing a successful licensing program
As first published in the Patent Lawyer, Martin Bijman, Director of IP Products at TechInsights, explains how formalized assertion programs can benefit rights holders.25Nov
DRAM Scaling Challenges Grow
More nodes and alternative memories are in the works, but schedules remain murky.21Nov
Comet Lake for desktop will appear around February 2020? Intel CPU roadmap
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Kirin 990 5G core data exposure: 113.31 square millimeters integrated 10.3 billion transistors
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The Apple U1 - Delayering the Chip and Its Possibilities
Posted: November 8, 2019 Contributing Authors: Stacy Wegner Figure 1: the Apple U1 UWB chip One of the most intriguing components included in the iPhone 11 is the mystery chip Apple simply labeled as ‘U1.’ TechInsights has been busily analyzing this08Nov
Huawei Mate 30 Pro 5G Teardown
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TIPS Webinar: Techniques to Analyze NAND Flash and SSD Devices
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Intel Core i7-1065G7 “Ice Lake” 10 nm 2nd Gen Processor Analysis
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The Evolution of SiC MOSFET Technology: A Retrospective
Posted: October 31, 2019 Contributing Author: Sinjin Dixon-Warren Silicon carbide (SiC) is a widely used industrial material. Widescale production by the Carborundum Company started in 1893 following the discovery of the Acheson process, which is31Oct
The Apple iPhone 11, 11 Pro & 11 Pro Max Review: Performance, Battery, & Camera Elevated
TechInsights has now officially released a die shot of the new Apple A13, and we can confirm a few assumptions on our side.27Oct
Apple U1 TMKA75 Ultra Wideband (UWB) Chip Analysis
One of the most interesting components from the recently released Apple iPhone 11 line of phones is one that Apple has said very little about; the Apple U1 Ultra Wideband (UWB) chip. So far, Apple has said only that the chip enables directional24Oct
TechInsights: iPhone 11 Pro Max Cameras Cost $73.5
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How e-mobility is changing the Automotive
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E-Government - Deep Analysis of Intel Ice Lake: Innovation across Six Pillars
At this year's Taipei Computer Show, Intel introduced the 10th generation Core processor, which is the 10nm process Ice Lake processor.07Oct
SK hynix 96L 3D PUC NAND Analysis
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Inside the Apple 1720 Charger included with the iPhone 11 Pro Max
Posted: September 27, 2019 Contributing Author: Sinjin Dixon-Warren The iPhone 11 Pro Max ships with the Apple 1720 18 W USB-C power delivery charger. This device is rated to delivery 5 V and 3 A or 9 V and 2 A. In follow up to our recent blog27Sep
TechInsights Analyses iPhone 11 Cameras
TechInsights publishes a teardown report of the new Apple iPhone 11 Pro Max smartphone with some info on its cameras:26Sep
Apple iPhone 11 Pro Teardowns Look Encouraging for STMicro and Sony
STMicroelectronics and Sony each appear to be supplying four chips for Apple's latest flagship iPhones. Many other historical iPhone suppliers also make appearances in the latest teardowns.26Sep
Apple iPhone 11 Pro Max Teardown
Posted: September 23, 2019 - Updated: October 1, 2019 Contributing Authors: Daniel Yang, Stacy Wegner, Albert Cowsky We are always excited to see a new Apple iPhone, and this year’s iPhone 11 line is no exception. This is the first ever Apple event23Sep
Patent licensing: The patent battleplan
Successful, high-return patent licensing programmes require planning. Peter Hanschke of TechInsights offers a guide to getting it right.23Sep
Webinar: Preparing to License: Using tools to Scale Your Licensing Program
Originally Presented: September 19, 2019 / 12:00pm to 1:00pm ET Hosted By: Martin Bijman Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not19Sep
Micron Analysis Overview: LPDDR4 DDR4 3D NAND Flash and XPoint Reverse Engineered
Posted: September 17, 2019 With 2018 revenue of $30.4B USD, 16.5% market share in NAND Flash Memory, and 23% market share in DRAM, Micron is one of the biggest players in storage and memory technology. For those looking to support their product17Sep
How Graphical Solutions Improve 3D NAND Effective Device Density
Driven by Moore's Law, memory and logic chip semiconductor manufacturers reduce product cost and improve performance by increasing transistor density.16Sep
Webinar: Power Semiconductor – A Market Overview & In-depth SiC and GaN Device Analysis
Previous Broadcast: Tuesday, September 10, 2019 and Tuesday, October 8, 2019 Hosted By: Jianchun Xu and Sinjin Dixon-Warren The power semiconductor market is estimated to reach $32B USD by the end of 2025. Fueled by increasing global demand for more10Sep
Lithium, the white gold of technology
The price of the mineral collapses, but the batteries continue to consume this white king.10Sep
Mobile manufacturing: How much do companies earn with the high end?
High-end smartphones have been increasing in price over the years to become unattainable devices for ordinary people.08Sep
Peloton IPO Preview: All Hype, No Muscle
Peloton, which manufactures and sells premium, large-screen, stationary fitness bikes and treadmills, as well streaming subscriptions for classes aimed at those using the equipment, is expected to go public sometime in the next few months.03Sep
Un móvil de gama alta se vende casi al triple de lo que cuesta fabricarlo
Un teléfono móvil se vende casi tres veces más caro de lo que cuesta fabricarlo, atendiendo al coste de todos los componentes que integran estos dispositivos, desde la batería o la cámara hasta el sistema operativo que permite que funcionen las02Sep
A high-end mobile phone sells almost three times what it costs to manufacture it
A mobile phone is sold almost three times more expensive than it costs to manufacture it, taking into account the cost of all the components that make up these devices, from the battery or camera to the operating system that allows applications to02Sep
Tariffs on Chinese imports start on Sunday. News 8 looks at what they will cost you
Sunday will be the first round of tariffs. Almost monthly through the end of the year, the government plans to impose additional tariffs on different items.31Aug
Why I keep writing ’bout holes in the sensor
DPReview's review of the Fujifilm GFX 100 medium format camera shows the consequences of having dead pixels whose space is used for phase detection autofocus (PDAF) modules31Aug
Deca Technologies Fan-In WLP in Qualcomm PM8150
Posted: August 29, 2019 The fan-In WLP market expected to grow at a steady rate; from $2.9B in 2018 to $4.4B by 2024, at 6.5% CAGR. One of the recent contributors to this market is Deca Technologies, whose M-Series fan-out wafer-level packaging29Aug
GaN, SiC, and Si technologies in AC Adapters
Posted: August 14, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Introduction AC Adapters are a constant reminder that the mobile devices that we have come to love are not quite as mobile as we would like to think. Every single mobile device14Aug
Unexpected Design Wins in Huawei Mate 20 X (5G) Teardown
2019 is the year that we have seen the 5G smartphones start to take off. TechInsights posted a blog of the Samsung Galaxy S10 5G teardown in April, which was the world’s first 5G mobile handset in Korea. The Galaxy S10 5G SM-G977N is based on Samsung02Aug
Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF)
4-Part Blog Series: The state of the art of smartphone imagers Part 4: Non-Bayer CFA, Phase Detection Autofocus (PDAF) Posted: July 30, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image30Jul
Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI)
4-Part Blog Series: The state of the art of smartphone imagers Part 3: Back-Illuminated Active Si Thickness, Deep Trench Isolation (DTI) Posted: July 23, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the23Jul
Velodyne LiDAR Puck Teardown
Posted: July 22, 2019 According to BIS Research, the automotive LiDAR market was estimated at $353M USD in 2017, and is anticipated to reach $8.32B by 2028. The LiDAR market is set to become one of the most competitive segments of the automotive22Jul
Part 2: Pixel Scaling and Scaling Enablers
4-Part Blog Series: The state of the art of smartphone imagers Part 2: Pixel Scaling and Scaling Enablers Posted: July 16, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ paper for the International Image Sensors Workshop16Jul
AC Adapters: GaN, SiC or Si?
Effective high-power, compact AC adapters can be built using SiC, GaN, and Si super junction devices, according to an analysis by TechInsights of three key products.16Jul
Part 1: Chip-stacking and chip-to-chip interconnect
4-Part Blog Series: The State-of-the-Art of Smartphone Imagers Part 1: Chip-stacking and chip-to-chip interconnect Posted: July 09, 2019 Contributing Author: Ray Fontaine Content adapted from TechInsights’ presentation for the International Image09Jul
Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU
Posted: June 11, 2019 Ambiq Micro Apollo 3 Blue Ultra-Low Power MCU The MCU marketplace is crowded and competitive, with semiconductor companies globally increasing R&D spend in this technology area; this market is forecast to reach ~$20B USD in 201910Jun
1y DDR4 DRAM from Samsung, SK hynix and Micron
Posted: June 7, 2019 Samsung LPDDR4X 17 nm 1Y Samsung DDR4 17 nm 1Y Micron MT40A2G4SA-062E 8Gb DDR4 The top 3 DRAM manufacturers (Samsung, SK hynix, and Micron) reached sub-20 nm in 2017 and 2018 with the introduction of 1x. A new milestone was05Jun
How long can Sony keep the top spot in the image sensor market?
Not long ago, Yuanta Research released market data on global CIS (CMOS image sensor), pointing out that its overall market size is still growing rapidly.05Jun
Qualcomm QTM052 mmWave Antenna Module
Posted: May 31, 2019 Qualcomm QTM052 mmWave Antenna Module Qualcomm claims to have “Made the impossible, possible” by incorporating mmWave technology into the mobile RF front end in a small, highly integrated module. There are many challenges31May
NAND technology: Open the gates
In the $60bn NAND tech market, patent landscape analysis can give companies the edge, as Martin Bijman and Trevor Izsak of TechInsights explain.13May
Webinar: Identifying and Pursuing Patent Infringers - Using Technical Evidence to Build Your Assertion campaign
At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.02May
Electric Cars Gain Traction, But Challenges Remain
(Semiconductor Engineering) Battery-powered electric vehicles are expected to reach a milestone in terms of shipments in 2019, but the technology faces several significant hurdles to gain wider adoption in the market.22Apr
TechInsights memory technology update from IEDM18
Posted: April 11, 2019 Contributing Author: Dick James, Jeongdong Choe On the Sunday evening at IEDM last year, TechInsights held a reception in which Arabinda Das and Jeongdong Choe gave presentations that attracted a roomful of conference attendees11Apr
9X Layer 3D NAND Analysis
Posted: April 10, 2019 TechInsights’ Analysis of Solutions from Samsung, Toshiba, and Intel/Micron TechInsights’ analysis has begun on the much-anticipated 9XL 3D NAND solutions, including: Samsung 92L 3D V-NAND Toshiba 96L 3D BiCS Intel/Micron 96L10Apr
Samsung Galaxy S10 5G Teardown
Posted: April 9, 2019 Contributing Author: Daniel Yang & Stacy Wegner It’s here. It’s in our labs... Two major 5G events happened last week: Verizon launched their 5G network in Chicago, and on the other side of the globe, Samsung launched the world09Apr
Analyzing innovations in mobile radio frequency front-end integration
Posted: April 09, 2019 The mobile RF front-end architectures of 3G and early 4G smartphones were relatively simple and could be built from discrete components. The mobile radio frequency (RF) front-end today has become much more complex to support09Apr
Webinar: High-Density Fan-Out Package Technologies – Examination and Comparison
Originally Presented: April 9, 2019 / 2:00pm to 3:00pm ET Hosted By: Michel Roy Low-density fan-out package technology has been around for more than a decade. Due to limitations in RDL counts and capabilities in line space / line width, this09Apr
3D NAND Metrology Challenges Growing
(Semiconductor Engineering) The big challenge is to characterize the inner portions of a 3D NAND device, which consists of complex materials, multiple layers and tiny channel holes. Then, as you add more layers, the metrology challenges increase “due09Apr
Autonomous Vehicles are Driving Innovation
Advances in AVs are having a ripple effect in multiple technology fields, from radar and LiDAR to signal processing. However, the rapid innovation pace is also creating challenges for automakers.29Mar
Siemens patent filings climb, but quality over quantity is the name of the game
In 2018 Siemens leapfrogged Huawei to become the number one filer at the EPO, a spot that it has not occupied since 2011. It has invested ...25Mar
Samsung Galaxy S10+ Teardown
Posted: March 1, 2019 Contributing Authors: Michelle Alarcon, Daniel Yang, Stacy Wegner, Albert Cowsky We got the new Samsung Galaxy S10+ a little early! TechInsights received the Exynos Samsung Galaxy S10+ SM-G975F/DS from Korea and it has been in01Mar
Webinar: The Mobile Radio Frequency Landscape
Originally Presented: February 27, 2019 / 3:00pm to 4:00pm ET Hosted By: John Sullivan A Patent and Technology Perspective We estimate the mobile Radio Frequency (RF) market to be worth approximately $19B. Mobile RF innovation aims to improve27Feb
Lenovo Brings the New Snapdragon to Market
Posted: February 20, 2019 Contributing Authors: Stacy Wegner and Daniel Yang Lenovo Z5 Pro GT How long would it take you to count from 1 to 220,000? Probably longer than 32 seconds, and yet 32 seconds is reportedly how long it look for Lenovo to sell20Feb
Navitas Found Inside the RAVPower RP-PC104-W Gallium Nitride 45 W USB C Power Delivery Charger
Posted: February 7, 2019 Contributing Authors: Sinjin Dixon-Warren, PhD Figure 1 – RAVPower RP-PC104 USB-C Charger One of the primary emerging applications for 650 V gallium nitride (GaN) power High Electron Mobility Transistors (HEMT) is likely to07Feb
Tesla Poised to Apply Maxwell’s Dry Electrode Innovation to Battery Cell Fabrication
Posted: February 7, 2019 Contributing Authors: Marty Bijman and Jim Hines Figure 1 – Tesla's portfolio including Maxwell and SolarCity acquisitions Figure 2 – Tesla Portfolio landscapes showing which inventions originated from Tesla, SolarCity, and07Feb
Webinar: Finding Evidence of Use in Technology - the Good, the Bad, and the Ugly
Originally Presented: December 12, 2018 / 2:00pm to 3:00pm ET Hosted By: Martin Bijman TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can12Dec
Webinar: Using Technical Evidence to Strengthen Patents
Originally Presented: October 23, 2018 / 12:00pm to 1:00pm ET Hosted By: Mary Lupul Patent Strengthening is a term we use to describe the different methods that can be applied during the prosecution to both maximize the usefulness of a patent once it23Oct
Webinar: Optimizing Patent Prosecution to Achieve Stronger, More Valuable Patents
Originally Presented: October 4, 2018 / 12:00 pm - 1:00 pm EDT Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –04Oct
Webinar: Comparing leading STBs, Streaming Devices, and Smart TVs - A design and BoM perspective
Originally Presented: September 18, 2018 / 2:00pm to 3:00pm ET Hosted By: Stacy Wegner With a significant cord-cutting trend, much has been said about how operators are reacting and modifying their offerings to retain subscribers tempted by streaming18Sep
Automotive Patents: Owners, Technologies, and Investigating for EOU
Originally Presented: July 11, 2018 / 2:00pm to 3:00pm ET Hosted By: Jim Hines The automotive industry is facing disruption from new market entrants, emerging mobility business models and changing consumer attitudes about car ownership. The future of11Jul
Creating Better Applications Through Patent Strengthening
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.20Jun
Intel 10 nm Logic Process Analysis (Cannon Lake)
Posted: June 12, 2018 Intel 10nm Logic Process Analysis TechInsights has found the long-awaited Cannon Lake - the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad330. This innovation boasts the following: Logic transistor12Jun
SK hynix 72L 3D NAND Analysis
Posted: May 31, 2018 SK hynix 72L 3D NAND Analysis SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation has a block size 50% larger compared to 48-layer 3D TLC chips, it has a lower programming time31May
Webinar: Black Box Reveal - Investigating Patented Technology in Challenging Product Areas
Originally Presented: May 3, 2018 / 3:15pm to 4:00pm ET Hosted By: Martin Bijman "Black box reveal" is the term we use to refer to “the hard stuff” – technology that, for one reason or another, is difficult to analyze for evidence of use. These can03May
What does Uber’s patent landscape look like?
Posted: February 27, 2018 Contributing Authors: Marty Bijman Recently, IAM’s Timothy Au posted a blog providing a look at Uber’s portfolio. The blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years27Feb
Webinar: Patent Portfolio Monetization Key Considerations for Companies in 2018 and Beyond
Originally Presented: February 20, 2018 / 3:00 pm to 5:00 pm ET Hosted By: Martin Bijman & George Pappas Patent strengthening is the term that refers to the process of achieving the greatest potential for value from a patent during the prosecution –20Feb
Webinar: Unlocking the Value in Software Patents - a Technical Perspective
Originally Presented: February 1, 2018 / 12:00 pm - 1:00 pm ETHosted By: Mike McLean, Gene Quinn & Walter Hanchuk Alice has had an impact on software patents, but they can and still do hold significant value. If your portfolio includes software01Feb
Job Vacancy: VP, Financial Controller
Reporting to the CFO, as the VP Finance, you will provide leadership to the Finance team members responsible for the day-to-day accounting, payroll, tax and treasury, reporting, planning, budgeting and statutory filings. You will regulate corporate11Sep
Job Vacancy: Software Developer
We are currently seeking a Full Stack Software Developer to join one of our Colorado TechInsights Platform development teams. Do you have a passion for solving complex and interesting problems? Do you strive to learn something new every day? Do you11Sep
Job Vacancy: Sales Representative
The Inside Sales Representative is a key member of the go-to-market sales team. Working in close cooperation with the outside sales and Marketing teams, you will be responsible for following up on leads while identifying new business or sales10Sep
Job Vacancy: VP, Sales Operations
Thanks to our growth, we are now recruiting an individual to lead our Sales Operations functions and further evolve the business via the support of our corporate goals and objectives, including, but not limited to: reporting, analysis, business09Sep