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We found some interesting surprises in this phone, including: Google’s custom-designed Titan M security processor, STMicroelectronics wins the ambient light sensor socket, and STMicroelectronics wins the secure MCU socket.
Fitbit Charge 3, a New Design Win for Cypress Semiconductor, and your New Year’s Resolutions
"Made in China" once often meant "assembled" there. Now it’s mastering the art of making everything.
MicroVision, based in Redmond WA, now in partnership with STMicroelectronics, has been a technology leader in the small form factor laser beam scanning (LBS) projector market.
TechInsights looks into the four main low-power wide-area-network technologies from the reverse-engineering angle via semiconductor die analysis, and its place in the IoT market.
This year, Apple is using the tagline "Welcome to the big screens" to unveil the iPhone Xs Max and iPhone Xs. We have all the details in the blog, including the A12 processor, design wins and costing.
What’s inside one of the most anticipated phones of the summer? See TechInsights’ Samsung Galaxy Note9 teardown blog to learn who won what sockets.
TechInsights has found the Intel 10 nm logic process inside the i3-8121U CPU, used in the Lenovo IdeaPad 330.
SK hynix claims to have created the industry’s first-ever 72-layer 256Gb 3D NAND flash. This innovation is based on triple-level cell technology (TLC), it has a block size 50% larger compared to 48-layer 3D TLC chips, and it has a lower programming time (tPROG).
Patent strengthening is the term we use to refer to the process of achieving the greatest potential for value from a patent during the prosecution – before a patent is even granted.
The IAM blog references Uber’s portfolio makeup, and provides a chronicle of their IP events over the last 5 years. TechInsights' Martin Bijman adds to the story with some competitive landscape analysis.
It has been a year since Microsoft released the Azure IP Advantage program – a service that "provides the industry’s most comprehensive protection against intellectual property (IP) risks" by making 10,000 of their global patents available to Azure clients.
TechInsights has found the Micron 1x process in the Micron DIMM (DDR4) and Huawei Mate 10 (LPDDR4). This process brings about smaller die sizes and increased bit density over its predecessor, but it also presented a bit of a surprise, the Micron 1xs.
Learn more about what reports we have available and planned for this part.
Samsung released their 64L 3D V-NAND solution in January of 2017 for key IT customers, and ramped up production in June for its expanded general market.
Toshiba released their 64L NAND solution (BiCS FLASH) in a SanDisk Ultra 3d SSD in 2017. TechInsights has conducted a significant amount of analysis on this product.
A longtime technology analyst predicts that Apple will unveil an A12X processor at its Oct. 30th event.
A move to a more advanced manufacturing tech allowed Intel to put more features into a smaller chip.
The self-driving car will redefine personal mobility and change the way people think about cars, believes Jim Hines.
First-half funding analysis shows continued robust investment in tech.
TechInsights has identified Evidence of Use (EoU) for over 6,000 unique patents. In doing so, we have significantly evolved our understanding of what patents can be supported with EOU and honed our expertise in mapping claim elements to evidence – sometimes in very difficult to detect applications.
１２月１２日（水）から１４日（金）東京ビックサイト. SEMICON Japan takes place in the heart of the semiconductor supply chain with more than 750 exhibiting companies from Japan and other regions, showcasing innovative solutions for your technology challenges and business success.
12月13日(木) 13:20-13:50に、弊社、テクノロジーアナリスのAndy Wei が、セミコンジャパンにて、セミナーをいたします。STS 先端デバイス・プロセスセッション(1)の部にて、A Comparison of 10nm CMOS Process Technologiesについて、プレゼンテーションをいたします。
The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.
TechInsights is happy to report that we have found and analyzed Anti-fuse array blocks on a Samsung 18 nm DDR4 DRAM die.
We confirmed Samsung has again dual-sourced the rear-camera chips and we expect to see the S5K2L3 (Samsung) and IMX345 (Sony) again this fall in the next-generation Samsung Note.
We asked Ray Fontaine, Senior Technical Analyst specializing in semiconductor fabrication process analysis and image sensors, for his thoughts on the most interesting developments in image sensor technology in 2017.
TechInsights published our first in a series of reports on this innovation that provides a memory density increase of 32.8% when comparing 8Gb DRAM 18 nm and 20 nm die.
TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).
Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS "Motion Eye" camera offering with 960 fps video and predictive capture.
The Qualcomm RF360 Chipset includes the WTR5975 Gigabit LTE Transceiver, QET4100 Envelope Tracker and the Snapdragon X16 LTE MDM9250 Modem.
The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.
This report is a circuit analysis of the Intel PMB5750 LTE Tranceiver. Apple’s use of the Intel modem chipset is a huge event in the industry as Intel modems will represent a minority of iPhone shipments (est. 22 M units in 2016 and 23 M units in 2017).