Winbond W63AH2NBVABE 25nm LPDDR3 1Gb Memory Floorplan Analysis

This is a Memory Floorplan Analysis (MFR) of the Winbond LPDDR3 SIRIUS D2D3 die with a memory capacity of 1 Gb and a 25 nm generation node. The memory arrays with array peripheral takes about 52% of the die area. The die area occupied by memory sub-arrays is estimated to be about 38%.

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