This report presents a Power Floorplan Analysis of the Texas Instruments (TI) LMG2610 device. The LMG2610 device is a half-bridge composed of 650 V gallium nitride (GaN) high-electron-mobility transistors (HEMTs) that is highly integrated and designed to be used in active-clamp flyback (ACF) converters.
TechInsights Appoints Dan Kim as Chief Strategy Officer
TechInsights has announced the appointment of Dan Kim as its new chief strategy officer, effective April 21, 2025. In this new role, Kim will lead TechInsights’ strategy and engagement with corporate and government customers across the Americas, Europe, and Asia.
Unlock the Future of Advanced Packaging: A Deep Dive into Hybrid Bonding
Discover how hybrid bonding is revolutionizing semiconductor packaging and driving the future of high-performance, low-power devices.
TechInsights’ NVIDIA HGX B200 Analysis Reveals HBM3E Supplier and Advanced Packaging Innovation
Explore TechInsights’ early analysis of NVIDIA’s HGX B200 AI accelerator, revealing SK hynix as the HBM3E supplier and showcasing the first commercial use of TSMC’s CoWoS-L packaging.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
