This report provides a deeper insight on the advanced packaging innovations used in the manufacturing of the JASMINER X4 ASIC bitcoin miner chip. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance or thermal management.
TechInsights Appoints Dan Kim as Chief Strategy Officer
TechInsights has announced the appointment of Dan Kim as its new chief strategy officer, effective April 21, 2025. In this new role, Kim will lead TechInsights’ strategy and engagement with corporate and government customers across the Americas, Europe, and Asia.
Unlock the Future of Advanced Packaging: A Deep Dive into Hybrid Bonding
Discover how hybrid bonding is revolutionizing semiconductor packaging and driving the future of high-performance, low-power devices.
TechInsights’ NVIDIA HGX B200 Analysis Reveals HBM3E Supplier and Advanced Packaging Innovation
Explore TechInsights’ early analysis of NVIDIA’s HGX B200 AI accelerator, revealing SK hynix as the HBM3E supplier and showcasing the first commercial use of TSMC’s CoWoS-L packaging.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.
