Sony IMX400 3-Layer Stacked (Exmor RS) CMOS Image Sensor

Posted: May 11, 2017

Sony Mobile announced the Xperia XZs at Mobile World Congress in February 2017. The Xperia XZs features a 1/2.3-inch optical format, 19 Mp resolution, Exmor RS “Motion Eye” camera offering with 960 fps video and predictive capture. The super slow motion functionality is made possible by world’s first memory stacked CIS.

Sony divulged details of its 3-layer stacked CMOS image sensor (CIS) technology at ISSCC 2017 (90 nm generation back-illuminated CIS top chip, 30 nm generation DRAM middle chip, and a 40 nm generation image signal processor (ISP) bottom chip).

Our analysis is now available on the IMX400 including the following reports:

Device Essentials
Cost-effective insight to the chip based on focused scope of analysis (SEM, optical cross section and SEM bevel images)

Advanced CMOS Essentials – Packaging
Cross-sectional SEM and SEM-EDS analyses of packaging and die stack features

Imager Process Review
Deep structural and feature analysis employing a broader suite of reverse engineering tools (SEM, SCM, TEM, TEM-EDS, SIMS, etc.)

Intel 10nm Logic Process Analysis

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