Order Activity is Edging Higher as Memory Pricing Recovers
Order activity for semiconductor equipment increased to 61 °F. Memory activity continues to increase from freezing levels as pricing continues to improve thanks to strong demand from HBM3 and the transition to DDR5. While memory and mobile are improving, DAO, Compute, and Advanced Packaging slipped last week. DAO continues to experience weakness in Industrial and Automotive markets, which are going through a correction and inventory digestion phase. Advanced packaging has gotten a nice boost this year from generative AI, however demand for general purpose servers remains weak putting pressure on this segment.
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