Intel SRMJF Xeon CPU Max 9462 Processor with Intel EMIB and Samsung HBM2e Technology Advanced Packaging Quick Look

Intel SRMJF Xeon CPU Max 9462 Processor with Intel EMIB and Samsung HBM2e Technology Advanced Packaging Quick Look

 
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This Advanced Packaging Quick Look (APQ) for the Intel Xeon CPU Max 9462 processor, provided as a companion deliverable for APQ-2308-801 projects. The Intel Xeon CPU Max 9462 server processor is a 32-core/64-thread processor with 75 MB of cache memory and includes 64 GB of in-package DRAM high bandwidth memory (HBM2e) using the Sapphire Rapids architecture with Socket 4677. The package is a multi-die design including four compute dies and four DRAM packages interconnected using Intel’s embedded multi-die interconnect bridge (EMIB) die technology.

The analysis was performed on a Supermicro SYS-741GE-TNRT GPU server tower from which an Intel Xeon CPU Max 9462 processor was extracted for analysis as part of the APQ-2308-801 analysis. Analysis focused on the structure of the printed wiring board (PWB), the EMIB interconnect, and the HBM2e packaging technology.

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