HiSilicon Kirin 9000s (SMIC 7nm, N+2) Process Flow Analysis

HiSilicon Kirin 9000s (SMIC 7nm, N+2) Process Flow Analysis

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This report provides an analysis of the process flow and integration used in the manufacture of the HiSilicon 9000s (Hi36A0 GFCV120) SoC die that powers the latest flagship smartphone, the Mate 60 Pro, released in September 2023, from China-based Huawei, a surprise announcement despite US sanctions. The SoC die was fabricated by Chinese foundry SMIC, using their second-generation 7nm process, referred to as the N+2 process. The SMIC 7nm (N+2) process is the first commercial use TechInsights has identified of the most-advanced logic process node without extreme ultraviolet (EUV), manufactured by a Chinese foundry that supports full system-on-chip (SoC) functional elements like bit cells (embedded SRAM), passive elements, and more. The spreadsheet lists the hundreds of process flow steps required in its manufacture.

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