Google Tensor G3 System-on-Chip Samsung Fanout Panel Level Packaging Advanced Packaging Quick Look

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The Tensor G3 chipset powers Google’s top of the line mobile handsets, the Pixel 8 family. Manufactured in a package-on-package (PoP) configuration, the Tensor G3 bottom package is paired with a Micron LPDDR5 top package. The bottom package is produced by Samsung using panel-level fanout and die embedding technologies. This report presents an Advanced Packaging Quick Look (APQ) analysis of Google’s latest mobile processor.

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