Deep Dive Teardown of the Honor X50 ALI-AN00 Smartphone
The Honor X50 was supplied for the first time by Qualcomm octa-core Snapdragon 6 Gen 1 processor SM6450-500-AB with package size 12.54 × 12.04 mm while the die size was 8.05 × 6.65 mm. It was produced in 4 nm technology and supports 5G and WiFi 6E connectivity. Qualcomm announced a new chipset on 6th September 2022. This model is made for the Chinese market and features 16 GB + 512 GB of memory. This combination of memory was the largest one offered in this model. It supports WiFi 5, Bluetooth 5.1, and GPS technology but does not have NFC connectivity. It also has an ambient light sensor and virtual proximity sensor, gyroscope and accelerometer, optical fingerprint, and compass. Eleven antennas were located on the main frame. They were connected to the main board, antenna board, and USB board, from which signals were related to the main board by flex cables.
The authoritative information platform to the semiconductor industry.
Discover why TechInsights stands as the semiconductor industry's most trusted source for actionable, in-depth intelligence.