Deep Dive Teardown of the Final ZE8000 FI-ZE8DPLTW Wireless Earbuds
The Final ZE800 headphones are equipped with full-range speakers with external dimensions of 9.39 x 4.37. Both headphones are equipped with two Bluetooth and audio SoC chips from Qualcomm. This is the chip responsible for the Bluetooth connection, audio processing, power amplifier, active noise cancellation and sensor support. On the outside of each earbud are two microphones.
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