Apple M2 Ultra Processor TSMC InFO-L Package Technology Advanced Packaging Quick Look Analysis
This advancing packaging quick look report (APQ) provides insight on the advanced packaging innovations used in the manufacturing of the Apple M2 Ultra Processor, utilizing TSMC InFO-L package technology. The analysis includes structural and materials analysis, and critical dimensions, providing information on form factor as well as insights into the architecture attributes that may relate to performance.
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