TechInsights Library - Work In Progress

 

Reports Added Last Month

Report Name Device Type Manufacturer Part Number Report Code
Architecture Report on the MediaTek MT6177W RF Transceiver RF Transceiver MediaTek MT6177W ARC-1806-201
MediaTek MT6186W RF Transceiver Architecture Analysis RF Transceiver MediaTek MT6186W ARC-1907-201
RF Architecture Analysis of the Samsung Shannon 5500 RF Transceiver RF Transceiver Samsung SHANNON_5500 ARC-1909-801
Toshiba TC35681 Bluetooth SoC Basic Floorplan Analysis RF Transceiver Toshiba TC35681FSG-002 BFR-1908-801
Nordic Semiconductor nRF52811 Bluetooth 5.1 Direction Finding SoC Basic Floorplan Analysis SoC (System-on-Chip) Nordic nRF52811-QFAA-R BFR-1908-802
Intel WCSAX200 Wi-Fi 6 Chip Basic Floorplan Analysis WiFi SoC Intel WCSAX200 BFR-1908-803
CircuitVision Analysis on the Qorvo 9 (3GD5) Envelope Tracker Envelope Tracking Power Supply Qorvo 3GD5 CAR-1811-202
Full Analog CircuitVision Analysis on the Texas Instruments SN2600B1 Li-Ion Management IC Li-Ion Management Texas Instruments SN2600B1 CAR-1811-203
CircuitVision Analysis on the RX Path of the Intel PMB5762 Mobile Transceiver RF Transceiver Intel PMB5762 CAR-1812-101
Custom Teardown of the USI UWB Module and Apple U1 (TMKA75 die) from the Apple iPhone 11 Pro Max A2161 UWB - Ultra Wide Band Universal Scientific Industrial USI_Comp CUT-1910-901
OmniVision OV16B10 Dual-Rear-Cam2 UNK-Blade-V9 Device Essentials Folder Camera Module Unknown Blade-V9_Dual-Rear_Cam2 DEF-1808-804
Samsung S5K2P7SQ CMOS Image Sensor Device Essentials Folder Report CMOS Image Sensor Samsung S5K2P7SQ_CIS DEF-1809-801
Samsung Exynos 7 Octa 7880 Samsung 14LPC FinFET Process Digital Floorplan Analysis Applications Processor Samsung 7880 DFR-1907-801
Intel i7-1065G7 (formerly Ice Lake) Intel 2nd Generation 10 nm FinFET Process Digital Floorplan Analysis Microprocessor Intel SRG0N DFR-1908-801
Samsung Exynos Octa 9825 Samsung 7LPP FinFET Process Digital Floorplan Analysis Applications Processor Samsung 9825 DFR-1908-802
Apple A12 Bionic APL1W81 TSMC 7FF Digital Floorplan Analysis   Apple TMJA46 FAR-1809-802
HiSilicon Hi3680 Kirin 980 Mobile Al Chipset TSMC 7FF FinFET Process Digital Functional Analysis   HiSilicon Technologies Co. Ltd Hi3680V200 FAR-1811-801
SpecTek PP038-093TP DDR4 DRAM (Micron 1y) Memory Floorplan Analysis DDR4 SDRAM SpecTek PP038-093TP MFR-1908-801
SK hynix HFB1A8MQ431A0M (H25FTMM1 Die) 96L 4D NAND Memory Floorplan Analysis NAND Flash Hynix HFB1A8MQ431A0MR MFR-1909-801
Navitas Semiconductor NV6252 GaN Power Essentials GaN Power IC Navitas Semiconductor NV6252 PEF-1902-801
 

Work In Progress

Report Name Device Type Manufacturer Part Number Report Code
Sony IMX250MZR Global Shutter CIS Device Essentials Folder CMOS Image Sensor Sony IMX250MZR DEF-1809-802
NVIDIA GV100-400-A1 TSMC 12FFN GPU Tensor Core D2 Standard Cell Essentials Graphics Processor nVIDIA GV100-400-A1 SCE-1804-801
NVIDIA GV100-400-A1 TSMC 12FFN L1 Datapath Area Tensor Core D4 Standard Cell Essentials Graphics Processor nVIDIA GV100-400-A1 SCE-1809-801
Apple U1 (TMKA75 die) UWB SoC Basic Floorplan Analysis Report UWB - Ultra Wide Band Universal Scientific Industrial USI_Comp BFR-1910-801
A12X Advanced Packaging Essentials Applications Processor Module Apple APL1083 APE-1904-802
Sony IMX586 Circuit Analysis Image Processor Sony PCT-AL10_Dual-Rear-Cam1_ISP CAR-1906-802
Samsung D1x DDR4 16Gb Memory Functional Analysis Report DDR4 SDRAM Samsung K4AAG085WM-BCTD MFR-1909-802
Sony 12 MP CIS from iPhone XS Max Rear-Facing Wide-Angle Camera Device Essentials Folder Camera Module Unknown A1921_Dual-Rear-Cam DEF-1809-804
Micron Technology MT53D512M64D4NZ-053 CAR LPDDR4 SDRAM Micron Technology MT53D512M64D4NZ-053_WT_D CAR-1910-201
Micron Technology MT40A2G4SA CAR DDR4 SDRAM Micron Technology MT40A2G4SA-062E_J CAR-1910-202
Shannon 965 RF Transceiver Partial Basic Functional Analysis RF Transceiver Samsung SHANNON_965 CWR-1910-901
Intel PMB5762 RF Transceiver Partial Basic Functional Analysis RF Transceiver Intel PMB5762 CWR-1910-902
Broadcom wi-fi 6/BT 5.0 wireless Basic Functional Analysis Report   Broadcom BCM4378 BFR-1910-802
OmniVision OS05A20 (OMN-OSE523) Device Essentials Folder CMOS Image Sensor OmniVision OSE523 DEF-1810-801
Samsung S5K2L4 Circuit Analysis CMOS Image Sensor Samsung S5K2L4SX_CIS CAR-1906-801
Qualcomm Snapdragon 675 GPU SoC Design Analysis Applications Processor Qualcomm SM6150 SDA-1906-801
Intel i3-8121U Cannon Lake Intel 10 nm SoC Overhead Layout Analysis DDR I/O to CPU Transition Region Standard Cell Essentials Microprocessor Intel i3-8121U_die SCE-1805-801
Samsung S5K3P9SP Device Essentials Plus Camera Module Unknown vivo_1851_Front-Cam DEP-1905-802
Microsoft Azure Kinect Circuit Analysis Camera Module Microsoft X948802-0C2 CAR-1908-801
Apple U1 (TMKA75 die) Ultra-Wideband die (USI RF Module of the iPhone 11) Architecture Report UWB - Ultra Wide Band Universal Scientific Industrial USI_Comp ARC-1910-801
Sanechips (ZTE IC) ZX297100 NB-IoT SoC Basic Floorplan Analysis Wireless ZTE ZX297100 BFR-1910-804
Canon LC1510 from the EOS R Mirrorless Digital Camera Device Essentials Folder CMOS Image Sensor Canon LC1510_CIS DEF-1810-802
NXP SN200 NFC Controller Basic Functional Analysis Report NFC Controller NXP Semiconductors 200VB111 BFR-1910-803
Exynos 9820 Advanced Packaging Essentials Applications Processor Samsung 9820 APE-1904-801
Qualcomm Snapdragon 675 CPU SoC Design Analysis Applications Processor Qualcomm SM6150 SDA-1906-802
ON Semi AFGHL50T65SQDC Power Essentials IGBT Transistor ON Semi AFGHL50T65SQDC PEF-1909-801
Micron 128Gb 3D eMMC NAND B05A die Memory Floorplan Analysis Report LPDDR3 Micron Technology MT29TZZZ7D7DKLAH-107 MFR-1910-801
OmniVision OV2775 CIS for Automotive Applications Device Essentials Folder CMOS Image Sensor OmniVision OV2775_CIS DEF-1809-803
Kirin 990 4G Huawei Mate 30 Pro Digital Floorplan Analysis Report   HiSilicon Technologies Co. Ltd HI3690_V100 DFR-1910-801
Samsung Galaxy S10 (5G) Li Ion Battery Exploratory Report Other Battery Samsung EB-BG977ABU EXR-1909-801
Micron 1y DDR4 Memory Design - Periphery DDR4 SDRAM Micron Technology MT40A2G4SA-062E_J MDP-1910-801
IBM Power9 GF 14HP FF SOI Digital Floorplan Analysis Report Microprocessor IBM 02CY297 DFR-1910-802
iPhone11 A13 Processor Transistor Characterization Report Applications Processor Module Apple A2223_PoP TCR-1910-801
OmniVision OS05A20 Device Essentials Plus Report Image Sensors OmniVision OS05A20 DEP-1810-801
Intel i3-8121U Intel 10 nm GPU 6.18-Track Standard Cell Essentials Microprocessor Intel i3-8121U_die SCE-1805-802
Micron Technology MT43A4G40200NFA-S15 ES:A Hybrid Memory Cube Gen 2 (HMC2) 3D Package with TSV - Advanced Packaging Other Memory and related Micron Technology MT43A4G40200NFA-S15_ES_A_die ACE-1810-801
[Tentative] Qualcomm SDR8150 LTE X24 Transceiver Circuit Analysis Report RF Transceiver Qualcomm SDR8150 ARC1906
SK Hynix 96L 3D NAND Memory Design - Periphery NAND Flash Hynix HFB1A8MQ431A0MR MDP-1909-801
CircuitVision Analysis of Select Blocks on the AMD Ryzen 7 (9500A) Processor - I/O Interface Microprocessor AMD YD1700BBM88AE CAR-1904-203
CircuitVision Analysis on Selected Blocks of the Texas Instruments TPS65917-Q1 PMIC Power Management IC Texas Instruments TPS65917A1 CAR-1904-901
Sony IMX309BQJ from Nikon Z7 Mirrorless Camera Device Essentials Folder CMOS Image Sensor Sony IMX309BQJ DEF-1811-802
CircuitVision Analysis on the Toshiba TH58LJT0T24BADE 96L 3D NAND Flash Memory Array and Data Path NAND Flash Toshiba TH58LJT0T24BADE CAR-1902-801
Sony IMX424 Device Essentials Plus Report CMOS Image Sensor Sony IMX424_CIS DEP-1811-801
Samsung Exynos 9110 Samsung Fan-Out Panel Level Packaging - Advanced Packaging Essentials Smartwatch Samsung SM-R810 ACE-1810-803
Sony Back-Illuminated ToF from the Oppo R17 Pro Device Essentials Folder CMOS Image Sensor Sony PBDM00_Triple-Rear-Cam1_ToF DEF-1811-803
CircuitVision Analysis on the Data Path of the Samsung K4A8G085WD-BCTD 1Y DDR4 DRAM DDR4 SDRAM Samsung K4A8G085WD-BCTD CAR-1904-801
OmniVision OV10650 CIS for Automotive Imaging Applications Device Essentials Folder CMOS Image Sensor OmniVision OV10650 DEF-1811-801
Sony IMX250MZR Device Essentials Plus CMOS Image Sensor Sony IMX250MZR DEP-1811-802
Apple U1 (TMKA75 die) Ultra-Wideband die (USI RF Module of the iPhone 11) Circuit Analysis Report UWB - Ultra Wide Band Universal Scientific Industrial USI_Comp CAR-1910-801