By acquiring Pensando, AMD will instantly offer DPUs alongside its CPUs and GPUs. Although it principally sells smart NICs, the startup recently announced a design win for its 7nm second-generation chip.
The new GlobalFoundries process combines photonic and digital components on a single 45nm chip. The primary application is data-center communications, but lidar and computing will benefit as well.
TSMC and Samsung have suffered lengthy delays in their 3nm processes, and the gain in density and other characteristics is smaller than in previous nodes. Intel says its future nodes are on schedule.
TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.
Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.
The Silicon Valley startup uses a new type of memristor to perform analog math for deep-learning acceleration. It provides nonvolatile storage and performs low-power AI computations.
EdgeCortix launched its first edge-AI inference chip by hardening its DNA IP, delivering low latency and high power efficiency for applications that fit into 5W to 20W.
The new deep-learning accelerator (DLA) can scale to more than 2,000 TOPS, providing a licensable core for applications such as autonomous driving and natural-language processing.
If you want to understand the progress of competitors and the recent situation of the market, this presentation reviews selected structural and feature highlights of Apple, Samsung, Xiaomi, Vivo, Huawei, and Sharp cameras, focusing on main & ultrawide cameras, and the periscope camera trends.
