ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards the end of the year with their 7 nm node devices

In this presentation, we will examine some of the areas of innovation in NAND Flash and SSD devices and provide an overview of the various testing methods we apply to analyze these innovations. This information is useful in supporting patents and finding evidence of use.

Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not simply plant a sign and expect licensees to arrive with checks.

At TechInsights we proactively explore consumer electronics to find innovative and disruptive power semiconductor events, and we want to share some of our findings on recent SiC and GaN devices we have analyzed.

At its heart, an assertion campaign relies on Evidence of Use (EoU), to demonstrate the existence of ongoing infringement. If no one is using the technology covered by your patent portfolio then your patents are not as valuable. Conversely, when there is EoU the value of a patent portfolio is greater.

In this webinar, we will look at the key structural elements of the two packaging solutions. Package cross-sections and RDL delayering images will be presented and discussed, which will provide attendees with an understanding of the proposed structures, and of the differences between the two technologies.

Manufacturers today, however, are faced with increased complexity brought about by new standards (such as 5G), carrier aggregation, multi-mode phones, and consumer’s ever-increasing demands for bandwidth and reduced power consumption.