Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge displays that do far more than navigation.
In this presentation we will survey the different GaN integration strategies that we have observed in recently procured USB adapters. It is believed that GaN brings compelling advantages in terms of efficiency for adapter and other power supply products; however, achieving these efficiencies in a cost-effective manner can be challenging.
The information presented in this webinar will be of greatest interest to those looking to understand the semiconductor design wins of the iPhone 12, and related financial implications to companies like Qualcomm, Broadcom, Skyworks, Qorvo, Cirrus Logic, Dialog Semiconductor, and more.
This presentation will examine some of the different structures we have seen through the evolution of these technologies, in particular the latest 3D-NAND and DRAM parts. We will also look at several historical applications of ALD/ALE technology that have been observed through reverse engineering.
Webinar: Space, Power, BEAMs – Shorten the trek to gain the edge in 5G transceiver design and manufacturing
During this 30-minute presentation our experts will provide exclusive insight of our findings on the latest 5G mmWave transceiver architecture with a focus on the solution, including the QTM052 Antenna module from Qualcomm.
ALD/ALE Process in Commercially Available Logic Devices 2018 saw the introduction of a new generation of logic products featuring finFET transistors headlined by Intel with their 10 nm generation microprocessor, followed by TSMC and Samsung towards the end of the year with their 7 nm node devices
This presentation on the Atomic Layer Deposition/Atomic Layer Etching (ALD/ALE) process examines some of the different structures we have seen during the evolution of these logic technologies, in particular the latest 7 nm and 10 nm devices.
In this webinar, we present a comparison of 9x-layer 3D NAND devices from major manufacturers: Samsung, KIOXIA / Western Digital, Intel / Micron and SK hynix. The process sequence is discussed, with emphasis on the word line pad (WLP), also commonly known as staircase.
This webinar will be a review of the 650 V power MOSFET ecosystem and IP landscape. We will discuss the technologies in light of an early seminal GaN HEMT patent, demonstrating how reverse engineering can show innovation.
In this presentation, we will examine some of the areas of innovation in NAND Flash and SSD devices and provide an overview of the various testing methods we apply to analyze these innovations. This information is useful in supporting patents and finding evidence of use.
Licensing is a tried and true means to monetize a patent portfolio, but those who will succeed on the path from patent ownership to patent profits will not simply plant a sign and expect licensees to arrive with checks.