The panel will discuss the making of power devices using semiconductors, power management technologies and products that use power efficiently, and the enforcement of the intellectual property rights associated with semiconductors and power management technologies.

The intent of this webinar is to share selected content from our 2020 Image Sensor Device Essentials (DEF) subscription annual presentation.

In this seminar we will discuss the major players, their technology choices and how they tie into the strict reliability standards required by the automotive industry.

Today, automobiles are more than just transportation devices. Automobiles are hotspots with entertainment systems, state of the art communications capabilities, and cutting edge displays that do far more than navigation.

In this presentation we will survey the different GaN integration strategies that we have observed in recently procured USB adapters. It is believed that GaN brings compelling advantages in terms of efficiency for adapter and other power supply products; however, achieving these efficiencies in a cost-effective manner can be challenging.

The information presented in this webinar will be of greatest interest to those looking to understand the semiconductor design wins of the iPhone 12, and related financial implications to companies like Qualcomm, Broadcom, Skyworks, Qorvo, Cirrus Logic, Dialog Semiconductor, and more.

This presentation will examine some of the different structures we have seen through the evolution of these technologies, in particular the latest 3D-NAND and DRAM parts. We will also look at several historical applications of ALD/ALE technology that have been observed through reverse engineering.

During this 30-minute presentation our experts will provide exclusive insight of our findings on the latest 5G mmWave transceiver architecture with a focus on the solution, including the QTM052 Antenna module from Qualcomm.

This presentation on the Atomic Layer Deposition/Atomic Layer Etching (ALD/ALE) process examines some of the different structures we have seen during the evolution of these logic technologies, in particular the latest 7 nm and 10 nm devices.

In this webinar, we present a comparison of 9x-layer 3D NAND devices from major manufacturers: Samsung, KIOXIA / Western Digital, Intel / Micron and SK hynix. The process sequence is discussed, with emphasis on the word line pad (WLP), also commonly known as staircase.

This webinar will be a review of the 650 V power MOSFET ecosystem and IP landscape. We will discuss the technologies in light of an early seminal GaN HEMT patent, demonstrating how reverse engineering can show innovation.