Part of a radio subsystem, Qualcomm’s Snapdragon X75 modem for 5G simplifies boards by interfacing with a better-integrated RF transceiver. It also increases performance through more AI horsepower, enhanced uplink technology, and denser QAM.

Intel has refreshed its midrange FPGAs, challenging market newcomers. The new family updates the fabric, CPUs, and DSPs while expanding the Agilex line.

Think Silicon is among the few companies developing low-cost, low-power GPU IP, offering cores to accelerate 2D, 2.5D, and 3D graphics. The new Nema Pico VG adds support for vector graphics, enabling slick GUIs.

Trained machine-learning models can be valuable, and techniques have been developed to identify them in case of theft. NXP has introduced a tool that implements a straightforward approach to watermarking image-classification neural networks.

The STM32H5 family updates STMicroelectronics’ high-performance-MCU line with additional security. Installing the new Secure Manager software on the flagship model can yield a complete security suite with no required coding.

Octeon 10 Fusion combines Arm Neoverse N2 CPUs, packet-processing hardware, DSPs, and in-line wireless accelerators. Targeting 5G infrastructure, it’s the only merchant-market integrated base-station processor for macrocells.

Packaging technology goes hand in hand with chiplets. Examples include basic PCB-based 2D structures, passive silicon interposers and bridges for 2.5D packages, 3D packages employing active interposers, and hybrid bonding.

Generative-AI models such as ChatGPT are typically large and run only in the cloud, but Qualcomm recently demonstrated a smaller image-generation model called Stable Diffusion performing inference on a smartphone.

The new Ceva XC20 architecture implements simultaneous multithreading in a vector DSP. The first product to use it, the XC22 more than doubles area efficiency compared with Ceva’s previous DSP cores.

Perceive has launched its second-generation AI SoC, Ergo 2, offering 3–4x higher performance than the previous generation. The new chip targets applications such as security, retail analytics, and visual inspection.

MediaTek’s new processor for mid-premium smartphones offers leading-edge 4 nm and Cortex-A715 technology. The company also introduced its first satellite-communications chip, allowing customers to match Apple.

Obtained through its Xilinx acquisition, AMD’s RFSoCs meld FPGA and processor functions with blocks for mobile infrastructure. The ZU64DR and ZU63DR join a line of RFSoCs that implement DFE functions.