Leading-edge technologies including artificial intelligence (AI), 5G, Internet of Things (IoT), MEMS and sensors, quantum computing and advanced 3D packaging will take center stage at SEMICON Japan 2021 Hybrid as visionary keynote speakers and industry leaders gather to share insights into the latest trends and innovations driving semiconductor industry growth.
With leading-edge technologies such as artificial intelligence (AI), 5G and robotics at the heart of digital transformation, SEMICON Europa 2021 will convene industry visionaries and experts for insights into the latest innovations and smart applications powering the next wave of semiconductor industry growth.
Global silicon wafer shipments are projected to register robust growth through 2024, with wafer area increasing 13.9% year-over-year in 2021 to a record high of nearly 14,000 millions of square inches (MSI), SEMI reported today in its annual silicon shipment forecast for the semiconductor industry.
Applied Materials, Inc. today unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.
Veeco Instruments Inc. (NASDAQ: VECO) announced today that it has received a multi-system order for its new ADS-800 SRD™ System from a leading semiconductor supplier.
ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today announced the receipt of an evaluation tool order for its Ultra C SAPS frontside cleaning tool from a major global semiconductor manufacturer.
Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.
Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions wrought by the pandemic, worldwide installed capacity for power and compound semiconductor fabs is projected to top 10 million wafers per month (WPM) for the first time in 2023, growing to 10.24 million WPM (in 200mm equivalents) and climbing to 10.6 million WPM in 2024, SEMI announced today in its Power & Compound Fab Report to 2024.
Informing the media, public, and investors about semiconductor manufacturing trends and semiconductor industry outlook in wafer fab equipment, ATE, and assembly tools throughout the week with data and summaries from VLSI's latest reports and data analytic programs.
