Featured Report Analysis
Analysis: Order Activity Remains Stable While ASPs Rise
Semiconductor equipment orders dipped slightly last week as market activity moderated, alongside the latest Industry Performance Data Table.
TSMC Leading Edge Wafer Pricing and Corporate Outlook - Module 1: General Comments
Five‑part series delivers a bottom‑up analysis of TSMC 5nm, 3nm, and 2nm nodes, starting with wafer pricing and margin dynamics.
Performance Trend of Apple’s Application Processors
Featured Content analyzes Apple AP performance trends, examining cache memory capacity, its impact on performance, and custom SRAM implementations.
2026 CMC Conference Presentations
Presentations from the 2026 Critical Materials Council conference cover key discussions across materials and semiconductor priorities.
Compliance Monitor Alert: House Foreign Affairs Committee advances historic export control package
Congress advanced bipartisan export control bills covering enforcement, tech limits, and global coordination, though their legislative path remains uncertain.
Advanced Packaging Quarterly Technical Synthesis - Q1 2026
Advanced Packaging Quarterly Q1 2026 synthesizes key analyses showing how packaging advances are driving scaling, AI performance, and adoption across end markets.
Logic Scaling for the Next Decade – Module 0: Introduction to the Series
Intro presentation launches the Logic Scaling video series, tracing device scaling from planar transistors to CFETs and 2D devices through the 2030s.
Summary - Samsung Galaxy S26+ (SM-S947B) Survey Plus Teardown
Survey Plus report analyzes the Galaxy S26+ Exynos 2600, detailing IC suppliers, RF design, packaging, sub‑assemblies, and component pricing.
Samsung Galaxy S26+ (SM-S947B) Survey Plus Teardown
Survey Plus report analyzes the Galaxy S26+ Exynos 2600, detailing IC content, RF design, packaging, sub‑assemblies, and cost structure.
Samsung Exynos 2600 Mobile SoC PoP with FO-WLP and Heat Path Block Packaging Technology - Advanced Packaging Essentials
APE report details Samsung Exynos 2600 packaging innovations, highlighting redesigned FO‑WLP with Heat Path Block technology and improved thermal management.
Advanced PMIC (Co-)Packaging Techniques in Smartphones and Smartwatches
Mobile devices are pushing PMICs to finer nodes and advanced packaging, with analysis spanning InFO, FO‑PLP, M‑Series, and module‑level PMIC integration.
Qualcomm ZIGGY_2.1.0 TSMC 40nm ReRAM Memory Floorplan Analysis
Memory Floorplan Report analyzes device architecture using advanced imaging, identifying node and foundry, sizing memory blocks, and assessing die and package costs.
OmniVision OV50X Advanced Floorplan Analysis
Advanced floorplan analysis examines OmniVision’s OV50X ISP die, a 50 MP 1″ stacked BI image sensor used in Xiaomi Tech 17 Ultra cameras.
IoT Connectivity SoC - Transceiver Floorplan | Briefing 1 | 2026
H1 2026 Wi‑Fi/IoT SoC briefing reviews Wi‑Fi, UWB, and Bluetooth technologies, radio designs, process nodes, foundries, and die costs.
Cisco Universal Quantum Switch: A Glimpse into the Future of Quantum Networking
Cisco unveils a quantum switch that enables interoperability across quantum systems, paving the way for a scalable Quantum Internet.
Bosch and ROHM push power SiC process development forward
Bosch and ROHM signal a new phase, pairing performance leadership with scale and lower costs for wider adoption.
Analysis: AI Datacenter Networking Vendor Spotlight – Lumentum, Key Laser Supplier
Increased demand for InP lasers has shown a constraint in Lumentum’s production capabilities.
Is Indium Phosphide the Semiconductor of the Future?
Examining Lumentum in the context of other key players competing in the high-growth optical interconnect market.