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Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
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Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Samsung SmartTag+ & Apple AirTag: An Ultra-Wide-Band Device Comparison
Like Bluetooth, the UWB is a short-range, low-power, radio-based communication technology whose primary purpose is for location discovery and device ranging. However, UWB offers a multitude of different functions, such as fast and reliable file-sharing features and secure transactions.
The EPC 2152 – A Fully Integrated GaN Half-Bridge IC
TechInsights comments on what the main reasons for this integration are, other innovations throughout the GaN die, and how there is not a ‘one size fits all’ approach in regard to power semiconductor devices.
Pat Gelsinger Takes us on a Trip Down Memory Lane – and a Look Ahead
Dick James, a Senior Fellow and Technology Analyst with TechInsights, entered the semiconductor industry in 1970, working for Philips Semiconductor. In this blog, he presents a retrospective of gate technology, ranging from 1971’s 10-micron design rules (!) through to the more modern 5-nanometer.
Main and Periscope Camera Trends at Apple, Samsung, Xiaomi, Vivo, Huawei, and Sharp
If you want to understand the progress of competitors and the recent situation of the market, this presentation reviews selected structural and feature highlights of Apple, Samsung, Xiaomi, Vivo, Huawei, and Sharp cameras, focusing on main & ultrawide cameras, and the periscope camera trends.
Sony Xperia 5 III uses a periscope camera with two Zoom settings
The Package channel continued building its periscope camera report database with a look inside the Sony Xperia 5 III smartphone. Notably, this is the first periscope camera TechInsights has examined that has a variable zoom; the magnification of the camera has two zoom settings.
Memory Components in Your Smartphones
Jeongdong Choe, TechInsight's Senior SME on Technology, compares China, Apple, and Samsung’s memory and storage components.Latest Report Analysis
This report presents a package analysis (PKG) of the STMicroelectronics 55G0AB IR front camera module from the Microsoft Surface Pro 8.
The OmniVisionOV60A is a color, 60 MP stacked back-illuminated CIS with 1/2.8” format for mobile applications.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
This report presents a power package analysis (PKG) of the Infineon IGI60F1414A1L CoolGaN™ 600 V IPS half-bridge. The IGI60F1414A1L integrates two GaN HEMT in a half-bridge configuration alongside a Si controller die and coreless transformer isolation, all packaged within thermally enhanced QFN-28 surface mount package for low system bill of materials. The IGI60F1414A1L is suitable for appliances ranging from 30 – 500 W.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."