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Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)

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Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products

Latest Report Analysis

This report presents a package analysis (PKG) of the STMicroelectronics 55G0AB IR front camera module from the Microsoft Surface Pro 8.
The OmniVisionOV60A is a color, 60 MP stacked back-illuminated CIS with 1/2.8” format for mobile applications.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
This report presents a power package analysis (PKG) of the Infineon IGI60F1414A1L CoolGaN™ 600 V IPS half-bridge. The IGI60F1414A1L integrates two GaN HEMT in a half-bridge configuration alongside a Si controller die and coreless transformer isolation, all packaged within thermally enhanced QFN-28 surface mount package for low system bill of materials. The IGI60F1414A1L is suitable for appliances ranging from 30 – 500 W.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."