Authoritative Semiconductor & Microelectronics Intelligence Platform
Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.
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Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
TechInsights Fall Processor Conference 2022
TechInsights is pleased to continue the semiannual TechInsights Fall Processor Conference (formerly Linley Fall Processor Conference) established more than a decade ago. Join us live and in person from Santa Clara to see the presentations and interact with speakers during Q&A, lunch, and the networking reception.
Webinar - Recent GaN Innovation, Moving from Consumer to Data Center and Automotive
In this webinar, Dr. Stephen Russell will delve into the innovations found within recently released GaN devices for both low-voltage (650 V) devices looking to enter the light industrial and even automotive markets.
Webinar - Memory Process and Integration Challenges: DRAM & NAND
In this Memory webinar, Dr. Jeongdong Choe gave an overview and discussed the latest memory technology trends and challenges, focusing on DRAM and NAND devices.
Qualcomm RF Front End Expansion: Beyond Smartphones
Having a true end-to-end, modem-to-antenna solution and capitalizing on the benefits of having developed class-leading mobile applications with integrated baseband (BB) processors/modems, there is nothing missing from Qualcomm’s portfolio.
TechInsights Acquires Strategy Analytics to Further Expand its Capabilities in Microelectronics Market Analysis
TechInsights is excited to announce the acquisition of Strategy Analytics, the foremost market analyst firm studying high value electronic products. The company supplies syndicated research across the global consumer technology sector, providing the deepest wireless and automotive coverage in the market.
Correctly Understanding the Intel 4 Scaling Value
Intel recently presented their Intel 4 process innovation at the 2022 VLSI Symposium. They shared quite a bit of information about the new process, as they have done with nodes previously before products were released.Latest Report Analysis
This report presents a package analysis of the STMicroelectronics VG6640AB1M 1.3 MP CMOS image sensor used for automotive, security, and other outdoor applications.
This presents a power package analysis (PKG) of the GaN Systems GS-065-060-3-B 650 V GaN E-HEMT. The product features a low Rds(on) of 25 mOhm, competitive with leading SiC devices in terms of on-resistance. It utilizes ‘GaNPX’ technology for low inductance and thermal resistance for demanding high power applications. It is suited to a wide range of applications such as AC-DC and DC-DC power converters, renewable energy and industrial applications.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a memory floorplan analysis of the Micron MT61K512M32KPA-21_U 1z nm 8 Gb GDDR6X DRAM extracted from the EVGA RTX 3090 Ti graphics card.
This report presents an advanced packaging essentials (APE) analysis of the Apple M1 Ultra extracted from the Mac Studio M1 Ultra (A2615).
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules