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Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Webinar – Recent PMIC Innovation and an Automotive Market Outlook
Join TechInsights’ Power Subject Matter Expert, Dr. Stephen Russell and Strategy Analytics’ Executive Director of the Powertrain, Body, Safety & Chassis (PBCS) and Electric Vehicles Service (EVS), Asif Anwar, as they present the Recent PMIC Innovation and an Automotive Market Outlook Power webinar.
eBook: Xiaomi Mi 12 Pro and the SurgeP1 Charging IC
This eBook takes an in depth look at Xiaomi's Mi 12 Pro's HyperCharging Protocol implemented by the Xiaomi SurgeP1 IC, which enabled the achievement of a full charge time of only 19 minutes for their Xiaomi Mi 12 smartphone.
Disruptive Event - Apple’s H2 BT 5.3 Audio SoC
Apple’s H2 BT 5.3 audio SoC – elevating the audio experience in the AirPods Pro 2
Disruptive Event - Broadcom BCM59365 Wireless Charging PMIC
New Broadcom BCM59365, featuring the most advanced wireless charging PMIC observed to date.
TechInsights Acquires IC Knowledge LLC
TechInsights Acquires IC Knowledge LLC in a Further Expansion of Its Platform of Semiconductor Market Analysis Content
Webinar: Fan-Out Packaging Technologies - The Past and Future
TSMC, Apple, and Samsung have all leveraged different Fan-Out Packaging. Join us to get an update on the latest progress of Wafer Level and Panel Level Fan-Out Packaging.Latest Report Analysis
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents an advanced memory essentials (AME) of the Fujitsu MB85R8M2TABGL-G 8 Mb FRAM.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a digital floorplan analysis (DFR) of the Nvidia Jetson AGX Orin AI SoC. The AGX Orin is designed for powerful AI computing in autonomous machines such as advanced robotics and other AI Edge applications. This report provides analysis of the IP blocks and other design features including the cell libraries used in the design of those block.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a battery essentials (BEF) of the Sunwoda A2866 stacked pouch Li-ion battery, extracted from the Apple iPhone 14 Pro.