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Latest Report Analysis
This report presents a Standard Floorplan Analysis of the ISP die from the OmniVision OX08B4C, an 8.3 MP, 2.1 μm pixel pitch, stacked back-illuminated CMOS Image Sensor from the Sensing World SG8-OX08BC-5300-GMSL2 automotive camera.
This report presents a digital floorplan analysis (DFR) of the GoPro GP2 processor, fabricated using TSMC's 12FFC FinFET process.
This report presents a device essentials folder (DEF) of the SmartSens SC501CS 1/5" 5.0 MP resolution 1.12 µm pixel pitch CMOS image sensor, fabricated using SmartClarity-2 and SFCPixel technology, and extracted from the Samsung Galaxy A03s smartphone front-facing camera.
Survey Plus Reports include:
- Device Observations
- Analysis Summary
- Major IC Manufacturer Distribution
- RF Block Diagrams
- Main Enclosure material information
- Identify primary ICs and RF Modules such as SAW filters and Duplexers
- ICs and RF Modules categorized by Component Functions
- Provide package and die-size parameters
- Selected die photos
- Information on major sub-assemblies such as cameras and display/touchscreen subsystems
- Price estimates for the ICs and RF Modules
This report presents an advanced CMOS essentials (ACE) analysis of the MinerVa Semiconductor MINERVA7 Bitcoin ASIC, fabricated using SMIC's N+1 7 nm FinFET process.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."