Authoritative Semiconductor & Microelectronics Intelligence Platform

Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.

TechInsights is proud to support a fair marketplace which promotes innovation, and where electronics Intellectual Property can be created and monetized to advance the world we live in.

Competitive Technology Intelligence

Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)

Platform for the Semiconductor Industry

TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics

Intellectual Property

Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products

Latest Report Analysis

A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
The samples for this report were removed from the Apple iPhone 14 Pro 5G smartphone.
This report presents a power floorplan analysis (PFR) of the Southchip SC3056QDGR 650 V 368 mΩ GaN enhancement-mode power transistor, extracted from the Anker 511 30 W USB-C wall charger.
This report presents a basic floorplan analysis (BFR) of the Broadcom BCM6756KFEBG Wi-Fi 6/6E quad-core ARM SoC, extracted from the China Mobile TY-6261M internet router.
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
This report presents a Memory Floorplan Analysis of the embedded flash (eFlash) on the NXP Semiconductors SN200 die found inside the NXP 200VB111 component. The 200VB111 packagewas extracted from the Apple A211 iPhone 11 smartphone downstream product.