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Competitive Technology Intelligence

Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)

Platform for the Semiconductor Industry

TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics

Intellectual Property

Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products

Latest Report Analysis

This report presents a Standard Floorplan Analysis of the ISP die from the OmniVision OX08B4C, an 8.3 MP, 2.1 μm pixel pitch, stacked back-illuminated CMOS Image Sensor from the Sensing World SG8-OX08BC-5300-GMSL2 automotive camera.
This report presents a digital floorplan analysis (DFR) of the GoPro GP2 processor, fabricated using TSMC's 12FFC FinFET process.
This report presents a device essentials folder (DEF) of the SmartSens SC501CS 1/5" 5.0 MP resolution 1.12 µm pixel pitch CMOS image sensor, fabricated using SmartClarity-2 and SFCPixel technology, and extracted from the Samsung Galaxy A03s smartphone front-facing camera.
Survey Plus Reports include:
  • Device Observations
  • Analysis Summary
  • Major IC Manufacturer Distribution
  • RF Block Diagrams
  • Main Enclosure material information
  • Identify primary ICs and RF Modules such as SAW filters and Duplexers
  • ICs and RF Modules categorized by Component Functions
  • Provide package and die-size parameters
  • Selected die photos
  • Information on major sub-assemblies such as cameras and display/touchscreen subsystems
  • Price estimates for the ICs and RF Modules
This report presents an advanced CMOS essentials (ACE) analysis of the MinerVa Semiconductor MINERVA7 Bitcoin ASIC, fabricated using SMIC's N+1 7 nm FinFET process.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."