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Leading the world in microelectronics reverse engineering, and building the content platform for the semiconductor industry.
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Competitive Technology Intelligence
Monitoring and analyzing semiconductor and microelectronics innovation from the system to the atomic level (sub 5 nm)
Platform for the Semiconductor Industry
TechInsights Platform provides a central repository of benchmarking data, costing, analysis, technology roadmaps, and schematics
Intellectual Property
Proving patent value in advanced technology markets, matching patent claims to the evidence of their use in consumer products
Latest Posts From Our Blogs
Linley Fall Processor Conference 2022
TechInsights is pleased to announce that the Linley Fall Processor Conference powered by TechInsights - a Hybrid Event, will be held in Santa Clara, California on November 1-2, 2022. If you cannot attend in person, tune in to our virtual livestream or watch the presentations OnDemand at your convenience.
Webinar - Mobile Radio Frequency: A Patent and Technology Perspective
This webinar describes how the RF market has evolved and how, more than ever, advanced investigations and prosecutions can be accomplished using technical analysis. Register for this webinar to get the latest perspective on the Mobile RF patent and technology landscape.
Webinar: Who will dominate in RF? Smartphone RF Front Ends at a crossroad: Qualcomm, OpenRF, Skyworks, etc.
In this 30 minute webinar followed by a live Q&A session, TechInsights / Strategy Analytics’ Christopher Taylor, Lead Analyst and Radu Trandafir, Lead Technology Analyst, examined key decisions faced by OEMs when choosing components to help you understand how market-leading approaches stack up.
Your webinar questions answered: Recent GaN Innovation
Answers to the numerous questions asked in the recent gallium nitride (GaN) focused webinar ‘Recent GaN Innovation: Moving from Consumer to Data Center and Automotive’.
eBook: Fast-Charging Algorithms of the iPhone 13 Pro Max and Samsung S22 Ultra
Find an analysis of the existing fast charging methods and their associated problems, and an investigation of the fast-charging techniques of the iPhone 13 Pro Max and Samsung S22 Ultra.
ROHM Gen 4 Discussion
Watch the 2-part video discussion that TechInsights’ own Dr. Stephen Russell and PGC Consultancy’s Professor Peter Gammon created to take a closer look at how groundbreaking improvements of ROHM’s 4th Gen SiC MOSFET, fits into the broader SiC market.Latest Report Analysis
This report presents a Memory Floorplan Analysis of the SK Hynix MDC5Q19002 die found inside the SK Hynix H54G56CYRB-X247 package. The H54G56CYRB-X247 component was extracted from the HPC 3B3U6AV Spectre x360 Convertible laptop computer.
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."
This report presents a basic floorplan analysis (BFR) of the Microchip Technology ATA8352 low-power UWB transceiver.